ADSP-21363SBBC-ENG AD [Analog Devices], ADSP-21363SBBC-ENG Datasheet - Page 43

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ADSP-21363SBBC-ENG

Manufacturer Part Number
ADSP-21363SBBC-ENG
Description
SHARC Processor
Manufacturer
AD [Analog Devices]
Datasheet
Preliminary Technical Data
PACKAGE DIMENSIONS
The ADSP-21363 is available in a 136-ball Mini-BGA package
and a 144-lead integrated heatsink LQFP package.
0.08 MAX (LEAD
COPLANARITY)
SEATING
PLANE
0.75
0.60 TYP
0.45
0.27
0.22
0.17
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS AND COMPLY WITH
2. ACTUAL PO SITION OF EACH LEAD IS WITHIN 0.08 OF ITS
3. CENTER DIMENSIONS ARE NOMINAL.
4. HEATSLUG IS COINCIDENT WI TH BO TTOM SURFACE AND DOES
0.15
0.05
TYP
JEDEC STANDARD MS-026-BFB-HD.
IDEAL POSITION, WHEN MEASURED IN THE LATERAL DIRECTI ON.
NOT PROTRUDE BEYOND IT.
DE TAIL A
1.60 MAX
1. 45
1. 40
1. 35
Figure 35. 144-Lead Integrated Heatsink LQFP (SQ-144-3)
0.50
BSC
TYP
(LEAD
PITCH)
Rev. PrA | Page 43 of 44 | September 2004
DETAIL A
36
1
144
3 7
PIN 1 INDICA TOR
22.00 BSC SQ
TOP VIE W (P INS DO WN)
HEATSLUG ON BOTTOM
(NOTE 4)
20. 00 BSC SQ
10 9
72
108
13.71
13.21
12.71
ADSP-21363
DIA

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