PIC12HV615-I/SN Microchip Technology, PIC12HV615-I/SN Datasheet - Page 154

• Manufacturer Part Number: PIC12HV615-I/SN
• Description: IC PIC MCU FLASH 1KX14 8SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12HV615-I/SN

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-SOIC (3.9mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12H
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS-232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F609/615/617/12HV609/615
16.9
DS41302D-page 154
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
*
Thermal Considerations


T
PD
P
P
P
These parameters are characterized but not tested.
I
T
DD
JA
JC
A
DIE
INTERNAL
I
DER
/
O
= Ambient temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C  T
Characteristic
A
 +125°C
149.5*
84.6*
41.2*
39.9*
211*
150*
Typ
3.0*
60*
44*
39*
9*
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
8-pin PDIP package
8-pin SOIC package
8-pin MSOP package
8-pin DFN 3x3mm package
8-pin DFN 4x4mm package
8-pin PDIP package
8-pin SOIC package
8-pin MSOP package
8-pin DFN 3x3mm package
8-pin DFN 4x4mm package
PD = P
P
(NOTE 1)
P
V
P
(NOTE 2)
OH
INTERNAL
I
DER
/
O
))
=  (I
= PD
INTERNAL
OL
= I
MAX
 2010 Microchip Technology Inc.
* V
DD
Conditions
(T
OL
+ P
x V
DIE
) +  (I
I
DD
/
O
- T
A
OH
)/
JA
* (V
DD
-