MCHC908MR8VFAE Freescale Semiconductor, MCHC908MR8VFAE Datasheet - Page 352
MCHC908MR8VFAE
Manufacturer Part Number
MCHC908MR8VFAE
Description
IC MCU 8K FLASH 8MHZ PWM 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet
1.MCHC908MR8VFAE.pdf
(372 pages)
Specifications of MCHC908MR8VFAE
Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM
Number Of I /o
16
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
32-LQFP
Processor Series
HC08MR
Core
HC08
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
33
Number Of Timers
4
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, M68CBL05CE
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCHC908MR8VFAE
Manufacturer:
Freescale
Quantity:
8 393
Company:
Part Number:
MCHC908MR8VFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Mechanical Specifications
22.3 32-Pin LQFP (Case #873A)
Technical Data
352
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
8
1
8X
M
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
X
–Z–
25
K
R
4X
4X
17
Q
0.20 (0.008)
Mechanical Specifications
–U–
0.20 (0.008)
V1
DETAIL AD
V
AB
AC
T–U
SECTION AE–AE
F
É É
É É
É É
É É
T–U
METAL
BASE
Z
J
N
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
M
W
A
B
C
D
E
F
G
H
J
K
N
P
Q
R
S
V
X
MC68HC908MR8 — Rev 4.1
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
DETAIL Y
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.200 REF
1.000 REF
1
12 REF
Freescale Semiconductor
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
AE
AE
MAX
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
5
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