MC9S12NE64CPV Freescale Semiconductor, MC9S12NE64CPV Datasheet - Page 501

IC MCU 25MHZ ETHERNT/PHY 112LQFP

MC9S12NE64CPV

Manufacturer Part Number
MC9S12NE64CPV
Description
IC MCU 25MHZ ETHERNT/PHY 112LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12NE64CPV

Mfg Application Notes
MC9S12NE64 Integrated Ethernet Controller Implementing an Ethernet Interface with the MC9S12NE64 Web Server Development with MC9S12NE64 and Open TCP
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, Ethernet, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.375 V ~ 3.465 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
70
Number Of Timers
16 bit
Operating Supply Voltage
- 0.3 V to + 3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
On-chip Adc
10 bit
For Use With
EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No RoHS Version Available

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Appendix A
Electrical Characteristics
This section contains the most accurate electrical information for the MC9S12NE64
microcontroller available at the time of publication. The information is subject to change.
This introduction is intended to give an overview on several common topics like power supply,
current injection etc.
A.1
The electrical parameters shown in this supplement are guaranteed by various methods. To give
the customer a better understanding the following classification is used and the parameters are
tagged accordingly in the tables where appropriate, under the “C” column heading.
P: Those parameters are guaranteed during production testing on each individual device.
C: Those parameters are achieved by the design characterization by measuring a statistically
relevant sample size across process variations. They are regularly verified by production monitors.
T: Those parameters are achieved by design characterization on a small sample size from typical
devices. All values shown in the typical column are within this category.
D: Those parameters are derived mainly from simulations.
A.2
The MC9S12NE64 uses several pins to supply power to the I/O ports, A/D converter, oscillator
and PLL, the Ethernet Physical Transceiver (EPHY), as well as the digital core.
Freescale Semiconductor
• The V
• The V
• The V
• V
• V
• V
• V
• PHY_VDDA, PHY_VSSA are power supply pins for EPHY analog
• PHY_VDDRX, PHY_VSSRX are power supply pins for EPHY receiver
DD1
DDPLL
SS1
DD1
Parameter Classification
Power Supply
, V
and V
DDX1
DDA
DDR
and V
The MC9S12NE64 is specified and tested at the 3.3-V range.
, V
SS1
, V
supplies the internal voltage regulator, and is the V
SSPLL
, V
SS2
, V
DD2
SSA
DDX2
DD2
are internally connected by metal
are internally connected by metal
supply the oscillator and the PLL
pair supplies the A/D converter and portions of the EPHY
, and V
, V
SSX1
SS2
, V
MC9S12NE64 Data Sheet, Rev. 1.1
are the supply pins for the digital logic
SSX2
pairs supply the I/O pins, and internal voltage regulator
NOTE
REGEN
signal
501

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