DF2329BVTE25V Renesas Electronics America, DF2329BVTE25V Datasheet - Page 144

IC H8S MCU FLASH 384K 120TQFP

DF2329BVTE25V

Manufacturer Part Number
DF2329BVTE25V
Description
IC H8S MCU FLASH 384K 120TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2329BVTE25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2329BVTE25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2329BVTE25V
Manufacturer:
Renesas
Quantity:
301
Part Number:
DF2329BVTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 2 Instruction Descriptions
2.2.36
LDM (LoaD to Multiple registers)
Operation
@SP+
Assembly-Language Format
LDM.L @SP+, <register list>
Operand Size
Longword
Description
This instruction restores data saved on the stack to a specified list of registers. Registers are
restored in descending order of register number.
Two, three, or four registers can be restored by one LDM instruction. The following ranges can be
specified in the register list.
Two registers:
Three registers: ER0–ER2 or ER4–ER6
Four registers: ER0–ER3 or ER4–ER7
Available Registers
ERn: ER0 to ER7
Rev. 4.00 Feb 24, 2006 page 128 of 322
REJ09B0139-0400
LDM
ERn (register list)
ER0–ER1, ER2–ER3, ER4–ER5, or ER6–ER7
Condition Code
H: Previous value remains unchanged.
N: Previous value remains unchanged.
Z: Previous value remains unchanged.
V: Previous value remains unchanged.
C: Previous value remains unchanged.
I
UI H
U
Restore Data from Stack
N
Z
— —
V
C

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