DF2329BVTE25V Renesas Electronics America, DF2329BVTE25V Datasheet - Page 23

• Manufacturer Part Number: DF2329BVTE25V
• Description: IC H8S MCU FLASH 384K 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2329BVTE25V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 87
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• For Use With: EDK2329 - DEV EVALUATION KIT H8S/2329
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: HD64F2329BVTE25V

Stack Structure: When the program counter (PC) is pushed onto the stack in a subroutine call,
and the PC, condition-code register (CCR), and extended control register (EXR) are pushed onto
the stack in exception handling, they are stored as shown in figure 1.3. When EXR is invalid, it is
not pushed onto the stack. For details, see the relevant hardware manual.
(2) Advanced Mode
In advanced mode the data address space is larger than for the H8/300H CPU.
Address Space: The 4-Gbyte maximum address space provides linear access to a maximum
16 Mbytes of program code and maximum 4 Gbytes of data.
Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as
the upper 16-bit segments of 32-bit registers or address registers.
Instruction Set: All instructions and addressing modes can be used.
SP
Notes: 1.
(a) Subroutine Branch
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored on return.
(16 bits)
Figure 1.3 Stack Structure in Normal Mode
PC
(SP
SP
*2
Rev. 4.00 Feb 24, 2006 page 7 of 322
)
(b) Exception Handling
Reserved
(16 bits)
CCR
EXR
CCR
PC
*1
*3
*1 *3
REJ09B0139-0400
Section 1 CPU