MC9S08LC36LH Freescale Semiconductor, MC9S08LC36LH Datasheet - Page 347

• Manufacturer Part Number: MC9S08LC36LH
• Description: IC MCU 36K FLASH 2K RAM 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08LC36LH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number Of I /o: 18
• Program Memory Size: 36KB (36K x 8)
• Program Memory Type: FLASH
• Ram Size: 2.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 2x12b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 64-LQFP
• Processor Series: S08LC
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2.5 KB
• Interface Type: I2C/SCI/SPI1/SPI2
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 18
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2-ch x 12-bit
• For Use With: DEMO9S08LC60 - BOARD DEMO FOR 9S08LC60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

A.11
This section provides details about program/erase times and program-erase endurance for the FLASH
memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations, see
Freescale Semiconductor
1
2
3
4
Supply voltage for program/erase
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random
location)
Byte program time (burst mode)
Page erase time
Mass erase time
Program/erase endurance
Data retention
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information
supplied for calculating approximate time to program and erase.
Typical endurance for FLASH was evaluated for this product family on the 9S12Dx64. For additional
information on how Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin
EB619/D, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature
and de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor
defines typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for
Nonvolatile Memory.
0 < f
0 < f
T
T = 25°C
FLASH Specifications
L
to T
Bus
Bus
(2)
H
< 20 MHz
< 8 MHz
= –40°C to + 85°C
Characteristic
(4)
(2)
(2)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
(1)
(3)
Table A-16. FLASH Characteristics
(2)
V
Symbol
prog/erase
V
f
t
t
t
t
t
t
FCLK
Burst
Mass
D_ret
Page
Fcyc
prog
Read
10,000
2.08
Min
150
1.8
1.8
15
5
Chapter 4,
100,000
Typical
20,000
4000
100
9
4
Appendix A Electrical Characteristics
“Memory.”
Max
6.67
200
3.6
3.6
3.6
—
—
—
cycles
years
Unit
t
t
t
t
kHz
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V
DD
supply.
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