DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 357
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Figure 13.1 shows a block diagram of the SCI_0, and figure 13.2 shows that of the SCI1 and
SCI_2.
SCK0
RxD0
TxD0
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
Parity check
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
RDR
RSR
Figure 13.1 Block Diagram of SCI_0
Parity generation
TDR
TSR
Module data bus
SCR:
SSR:
SCMR:
BRR:
SEMR:
reception control
Transmission/
External clock
Section 13 Serial Communication Interface (SCI)
SCMR
SEMR
SMR
SSR
SCR
Serial control register
Serial status register
Smart card mode register
Bit rate register
Serial expansion mode register
Rev. 5.00 Sep. 01, 2009 Page 305 of 656
Clock
Baud rate
generator
BRR
10.667 MHz operation
16 MHz operation
Average
transfer rate
generator
115.152 kbps
460.606 kbps
115.196 kbps
460.784 kbps
720 kbps
TIOCA1
TCLKA
TIOCA2
TPU
REJ09B0071-0500
data bus
TEI
TXI
RXI
ERI
Internal
φ
φ/4
φ/16
φ/64
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