DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 603
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Section 22 Power-Down Modes
Section 22 Power-Down Modes
In addition to the normal program execution state, the H8S/2268 Group and the H8S/2264 Group
have nine power-down modes in which operation of the CPU and oscillator is halted and power
dissipation is reduced. Low-power operation can be achieved by individually controlling the CPU,
on-chip peripheral modules, and so on.
The H8S/2268 Group and the H8S/2264 Group operating modes are as follows:
1. High-speed mode
2. Medium-speed mode
3. Subactive mode
4. Sleep mode
5. Subsleep mode
6. Watch mode
7. Module stop mode
8. Software standby mode
9. Hardware standby mode
2. to 9. are low power dissipation states. Sleep mode and sub-sleep mode are CPU states, medium-
speed mode is a CPU and bus master state, sub-active mode is a CPU and bus master and internal
peripheral function state, and module stop mode is an internal peripheral function (including bus
masters other than the CPU) state. Some of these states can be combined.
After a reset, the LSI is in high-speed mode with modules other than the DTC in module stop
mode.
Table 22.1 shows the internal state of the LSI in the respective modes. Table 22.2 shows the
conditions for shifting between the low power dissipation modes.
Figure 22.1 is a mode transition diagram.
Rev. 5.00 Sep. 01, 2009 Page 551 of 656
REJ09B0071-0500
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