DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 557
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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The differences between boot mode and user program mode are shown in table 20.1.
Figure 20.3 shows the operation flow for boot mode and figure 20.4 shows that for user program
mode.
Table 20.1 Differences between Boot Mode and User Program Mode
Total erase
Block erase
Programming control program *
Note: * To be provided by the user, in accordance with the recommended algorithm.
Notes: Only make a transition between user mode and user program mode when the CPU is
FWE = 1
User mode
not accessing the flash memory.
1. RAM emulation possible
2. MD1 = 0, MD2 = 0, P14 = 0, P16 = 0, P70 = 1
On-board programming mode
program mode
FWE = 0
Figure 20.2 Flash Memory State Transitions
User
MD1 = 1,
MD2 = 1,
FWE = 0
MD1 = 1,
MD2 = 1,
FWE = 1
*
Boot Mode
No
Program/program-verify
Yes
RES = 0
*
1
1
RES = 0
MD1 = 0
MD2 = 1,
FWE = 1
Reset state
Boot mode
Rev. 5.00 Sep. 01, 2009 Page 505 of 656
RES = 0
*
User Program Mode
Yes
Yes
Program/program-verify/erase/
erase-verify/emulation
2
RES = 0
Programmer
mode
REJ09B0071-0500
Section 20 ROM
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