DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 83
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Table 2.3
Notes: 1. Refers to the operand size.
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM *
STM *
2
2
2. Only register ER0 to ER6 should be used when using the STM/LDM instruction.
B: Byte
W: Word
L: Longword
Data Transfer Instructions
Size *
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
Rn (register list) → @–SP
Pushes two or more general registers onto the stack.
Rev. 5.00 Sep. 01, 2009 Page 31 of 656
REJ09B0071-0500
Section 2 CPU
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