AT32UC3A3128-ALUT Atmel, AT32UC3A3128-ALUT Datasheet - Page 227
![IC MCU 128KB FLASH 144LQFP](/photos/6/72/67244/144l1-lqfp_sml.jpg)
AT32UC3A3128-ALUT
Manufacturer Part Number
AT32UC3A3128-ALUT
Description
IC MCU 128KB FLASH 144LQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Specifications of AT32UC3A3128-ALUT
Core Processor
AVR
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Number Of I /o
110
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
96 KB
Interface Type
IrDA/SCI/SCIF/UDI
Maximum Clock Frequency
66 MHz
Number Of Timers
3
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
Minimum Operating Temperature
- 40 C
Controller Family/series
AT32UC3A
No. Of I/o's
109
Ram Memory Size
32KB
Cpu Speed
66MHz
No. Of Timers
1
Rohs Compliant
Yes
For Use With
ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3A3128-ALUT
Manufacturer:
Atmel
Quantity:
135
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Figure 16-8. Self Refresh Mode Behavior
16.7.6.2
32072C–AVR32–2010/03
SDRAMC_A[12:0]
SDCKE
NCS[1]
SDWE
SDCK
RAS
CAS
Low power mode
and Drive Strength (DS) parameters must be set by writing the corresponding fields in the LPR
register, and transmitted to the low power SDRAM device during initialization.
After initialization, as soon as the LPR.PASR, LPR.DS, or LPR.TCSR fields are modified and
self refresh mode is activated, the SDRAMC issues an Extended Load Mode Register command
to the SDRAM and the Extended Mode Register of the SDRAM device is accessed automati-
cally. The PASR/DS/TCSR parameters values are therefore updated before entry into self
refresh mode.
The SDRAM device must remain in self refresh mode for a minimum period of t
remain in self refresh mode for an indefinite period. This is described in
227.
This mode is selected by writing the value two to the LPR.LPCB field. Power consumption is
greater than in self refresh mode. All the input and output buffers of the SDRAM device are
deactivated except SDCKE, which remains low. In contrast to self refresh mode, the SDRAM
device cannot remain in low power mode longer than the refresh period (64 ms for a whole
device refresh operation). As no auto refresh operations are performed by the SDRAM itself, the
SDRAMC carries out the refresh operation. The exit procedure is faster than in self refresh
mode.
This is described in
Figure 16-9 on page
Self Refresh Mode
228.
To the SDRAM Controller
Access Request
AT32UC3A3/A4
T
XSR
Figure 16-8 on page
= 3
RAS
Row
and may
227
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