AT32UC3A3128-ALUT Atmel, AT32UC3A3128-ALUT Datasheet - Page 989
![IC MCU 128KB FLASH 144LQFP](/photos/6/72/67244/144l1-lqfp_sml.jpg)
AT32UC3A3128-ALUT
Manufacturer Part Number
AT32UC3A3128-ALUT
Description
IC MCU 128KB FLASH 144LQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Specifications of AT32UC3A3128-ALUT
Core Processor
AVR
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Number Of I /o
110
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
96 KB
Interface Type
IrDA/SCI/SCIF/UDI
Maximum Clock Frequency
66 MHz
Number Of Timers
3
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
Minimum Operating Temperature
- 40 C
Controller Family/series
AT32UC3A
No. Of I/o's
109
Ram Memory Size
32KB
Cpu Speed
66MHz
No. Of Timers
1
Rohs Compliant
Yes
For Use With
ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3A3128-ALUT
Manufacturer:
Atmel
Quantity:
135
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36. Mechanical Characteristics
36.1
36.1.1
36.1.2
32072C–AVR32–2010/03
Thermal Considerations
Thermal Data
Junction Temperature
Table 36-1
Table 36-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
page
Table 36-1 on page
characteristics” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
989.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
989.
JA
)
965.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
TFBGA144
TFBGA144
VFBGA100
VFBGA100
TQFP144
TQFP144
Package
AT32UC3A3/A4
Table 36-1 on
40.3
28.5
31.1
Typ
9.5
6.9
6.9
”Regulator
J
°C/W
°C/W
°C/W
in °C.
Unit
989
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