AT91SAM7SE32-AU Atmel, AT91SAM7SE32-AU Datasheet - Page 635

• Manufacturer Part Number: AT91SAM7SE32-AU
• Description: MCU ARM 32K HS FLASH 128-LQFP
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM7SE32-AU

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 55MHz
• Connectivity: EBI/EMI, I²C, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 88
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-LQFP
• Controller Family/series: AT91SAM7xxxx
• No. Of I/o's: 88
• Ram Memory Size: 8KB
• Cpu Speed: 48MHz
• No. Of Timers: 3
• Rohs Compliant: Yes
• Processor Series: AT91SAMx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: EBI, SPI, TWI, USART
• Maximum Clock Frequency: 55 MHz
• Number Of Programmable I/os: 88
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, KSK-AT91SAM7S-PL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM7SE-EK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: AT91SAM7SE-EK - EVAL BOARD FOR AT91SAM7SEAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

41. AT91SAM7SE512/256/32 Mechanical Characteristics
41.1
41.1.1
41.1.2
6222B–ATARM–26-Mar-07
Thermal Considerations
Thermal Data
Junction Temperature
Table 41-1
Table 41-1.
The average chip-junction temperature, T
where:
Symbol
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JA
JC
JC
Table
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
41-1.
T
summarizes the thermal resistance data depending on the package.
T
A
Parameter
Junction-to-ambient thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-case thermal resistance
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
JA
AT91SAM7SE512/256/32 Preliminary
)
609.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
Still Air
LQFP128
LQFP128
Package
BGA144
BGA144
Section 40.3 ”Power
Table
38.4
34.7
Typ
8.3
9.3
41-1.
°C/W
°C/W
°C/W
°C/W
Unit
635