S9S08SG8E2MTJ Freescale Semiconductor, S9S08SG8E2MTJ Datasheet - Page 17

• Manufacturer Part Number: S9S08SG8E2MTJ
• Description: MCU 2K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08SG8E2MTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP
• Processor Series: S08SG
• Core: HCS08
• Data Bus Width: 8 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Section Number
17.3 On-Chip Debug System (DBG) ....................................................................................................273
17.4 Register Definition ........................................................................................................................277
A.1 Introduction ...................................................................................................................................285
A.2 Parameter Classification ................................................................................................................285
A.3 Absolute Maximum Ratings ..........................................................................................................285
A.4 Thermal Characteristics .................................................................................................................287
A.5 ESD Protection and Latch-Up Immunity ......................................................................................289
A.6 DC Characteristics .........................................................................................................................290
A.7 Supply Current Characteristics ......................................................................................................294
A.8 External Oscillator (XOSC) Characteristics .................................................................................297
A.9 Internal Clock Source (ICS) Characteristics .................................................................................299
A.10 Analog Comparator (ACMP) Electricals ......................................................................................301
A.11 ADC Characteristics ......................................................................................................................302
A.12 AC Characteristics .........................................................................................................................305
A.13 FLASH Specifications ...................................................................................................................311
A.14 EMC Performance .........................................................................................................................312
B.1 Ordering Information ....................................................................................................................313
B.2 Package Information and Mechanical Drawings ..........................................................................313
Freescale Semiconductor
17.2.4 BDC Hardware Breakpoint .............................................................................................272
17.3.1 Comparators A and B ......................................................................................................273
17.3.2 Bus Capture Information and FIFO Operation ...............................................................273
17.3.3 Change-of-Flow Information ..........................................................................................274
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................274
17.3.5 Trigger Modes .................................................................................................................275
17.3.6 Hardware Breakpoints ....................................................................................................277
17.4.1 BDC Registers and Control Bits .....................................................................................277
17.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................279
17.4.3 DBG Registers and Control Bits .....................................................................................280
A.12.1 Control Timing ...............................................................................................................305
A.12.2 TPM/MTIM Module Timing ..........................................................................................307
A.12.3 SPI ...................................................................................................................................308
A.14.1 Radiated Emissions .........................................................................................................312
B.1.1 Device Numbering Scheme ............................................................................................313
Ordering Information and Mechanical Drawings
MC9S08SG8 MCU Series Data Sheet, Rev. 6
Electrical Characteristics
Appendix A
Appendix B
Title
Page
17