S9S08SG8E2MTJ Freescale Semiconductor, S9S08SG8E2MTJ Datasheet - Page 190

• Manufacturer Part Number: S9S08SG8E2MTJ
• Description: MCU 2K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08SG8E2MTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP
• Processor Series: S08SG
• Core: HCS08
• Data Bus Width: 8 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Chapter 13 Real-Time Counter (S08RTCV1)
190
BKGD/MS
RESET
V
V
SEE NOTE 3
DD
SS
V
V
V
V
DDA
SSA
REFH
REFL
(MC9S08SG8 = 8,192 BYTES)
REAL-TIME COUNTER (RTC)
(MC9S08SG4 = 4096 BYTES)
(MC9S08SG4 = 256 BYTES)
(MC9S08SG8 = 512 BYTES)
HCS08 SYSTEM CONTROL
LOW-POWER OSCILLATOR
RESETS AND INTERRUPTS
40-MHz INTERNAL CLOCK
MODES OF OPERATION
POWER MANAGEMENT
REGULATOR
Figure 13-1. MC9S08SG8 Series Block Diagram with RTC Module Highlighted
CPU
31.25 kHz to 38.4 kHz
VOLTAGE
COP
1 MHz to 16 MHz
SOURCE (ICS)
HCS08 CORE
USER FLASH
USER RAM
(XOSC)
LVD
BDC
MC9S08SG8 MCU Series Data Sheet, Rev. 6
EXTAL
XTAL
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI)
INTERFACE MODULE (SPI)
ANALOG COMPARATOR
DEBUG MODULE (DBG)
8-BIT MODULO TIMER
SERIAL PERIPHERAL
ANALOG-TO-DIGITAL
CONVERTER (ADC)
16-BIT TIMER/PWM
16-BIT TIMER/PWM
IIC MODULE (IIC)
MODULE (TPM1)
MODULE (TPM2)
MODULE (MTIM)
(ACMP)
10-BIT
NOTES
NOTE 1: Port B not available on 8-pin packages
NOTE 2: Port C not available on 8-pin or 16-pin packages.
NOTE 3: V
= Pin can be enabled as part of the ganged output drive feature.
DDA
ACMPO
ACMP–
ACMP+
/V
ADP11-ADP0
TxD
TPM1CH0
TPM1CH1
TPM2CH0
TPM2CH1
RxD
TCLK
TCLK
MOSI
SPSCK
SS
MISO
TCLK
SDA
SCL
REFH
and V
SSA
/V
REFL
, are double bonded to V
PTA2/PAI2/SDA/ADP2/ACMPO
SEE NOTE 1, 2
SEE NOTE 1, 2
PTA3/PAI3/SCL/ADP3
PTA1/PIA1/TPM2CH0/ADP1/ACMP–
PTA0/PIA0/TPM1CH0/TCLK/ADP0/ACMP+
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
PTB5/TPM1CH1/SS
PTB4/TPM2CH1/MISO
PTB3/PIB3/MOSI/ADP7
PTB2/PIB2/SPSCK/ADP6
PTB1/PIB1/TxD/ADP5
PTB0/PIB0/RxD/ADP4
PTC3/ADP11
PTC2/ADP10
PTC1/TPM1CH1/ADP9
PTC0/TPM1CH0/ADP8
Freescale Semiconductor
DD
and V
SS
respectively.