S9S08SG8E2MTJ Freescale Semiconductor, S9S08SG8E2MTJ Datasheet - Page 26

• Manufacturer Part Number: S9S08SG8E2MTJ
• Description: MCU 2K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08SG8E2MTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP
• Processor Series: S08SG
• Core: HCS08
• Data Bus Width: 8 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Chapter 2 Pins and Connections
for the overall system and a 0.1-μF ceramic bypass capacitor located as near to the MCU power pins as
practical to suppress high-frequency noise. Each pin must have a bypass capacitor for best noise
suppression.
2.2.2
Immediately after reset, the MCU uses an internally generated clock provided by the clock source
generator (ICS) module. For more information on the ICS, see
(S08ICSV2).”
The oscillator (XOSC) in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic
resonator. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL
input pin.
Refer to
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R
is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity and
lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when selecting C1 and C2. The crystal manufacturer typically specifies a load capacitance
which is the series combination of C1 and C2 (which are usually the same size). As a first-order
approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin
(EXTAL and XTAL).
2.2.3
RESET is a dedicated pin with open-drain drive containing an internal pull-up device. Internal power-on
reset and low-voltage reset circuitry typically make external reset circuitry unnecessary. This pin is
normally connected to the standard 6-pin background debug connector so a development system can
directly reset the MCU system. If desired, a manual external reset can be added by supplying a simple
switch to ground (pull reset pin low to force a reset).
Whenever any reset is initiated (whether from an external signal or from an internal system), the RESET
pin is driven low for about 66 bus cycles. The reset circuitry decodes the cause of reset and records it by
setting a corresponding bit in the system reset status register (SRS).
25
F
is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup; its value
Figure 2-4
Oscillator (XOSC)
RESET Pin
This pin does not contain a clamp diode to V
above V
for the following discussion. R
DD
.
MC9S08SG8 MCU Series Data Sheet, Rev. 6
NOTE
S
(when used) and R
DD
Chapter 10, “Internal Clock Source
and should not be driven
F
should be low-inductance
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