S9S08SG8E2MTJ Freescale Semiconductor, S9S08SG8E2MTJ Datasheet - Page 28

• Manufacturer Part Number: S9S08SG8E2MTJ
• Description: MCU 2K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08SG8E2MTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP
• Processor Series: S08SG
• Core: HCS08
• Data Bus Width: 8 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Chapter 2 Pins and Connections
The MC9S08SG8 Series devices contain a ganged output drive feature that allows a safe and reliable
method of allowing pins to be tied together externally to produce a higher output current drive. See
6.3, “Ganged
27
Output” for more information for configuring the port pins for ganged output drive.
To avoid extra current drain from floating input pins, the reset initialization
routine in the application program should either enable on-chip pull-up
devices or change the direction of unused pins to outputs so they do not float.
When using the 8-pin devices, the user must either enable on-chip pullup
devices or change the direction of non-bonded out port B and port C pins to
outputs so the pins do not float.
When using the 16-pin devices, the user must either enable on-chip pullup
devices or change the direction of non-bonded out port C pins to outputs so
the pins do not float.
MC9S08SG8 MCU Series Data Sheet, Rev. 6
NOTE
Freescale Semiconductor
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