MC9S08SH16MTG Freescale Semiconductor, MC9S08SH16MTG Datasheet - Page 101
MC9S08SH16MTG
Manufacturer Part Number
MC9S08SH16MTG
Description
MCU 8BIT 16K FLASH 16-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08SH16CTG.pdf
(328 pages)
Specifications of MC9S08SH16MTG
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
16-TSSOP
Core
S08
Processor Series
MC9S08Sxx
Data Bus Width
8 bit
Maximum Clock Frequency
40 MHz
Data Ram Size
1 KB
On-chip Adc
Yes
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Operating Temperature Range
- 40 C to + 125 C
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
8
Height
1.05 mm
Interface Type
SCI, SPI, I2C
Length
5 mm
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Width
4.4 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
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Chapter 7 Central Processor Unit (S08CPUV3)
7.4.5
BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active background
mode rather than continuing the user program.
MC9S08SH32 Series Data Sheet, Rev. 2
Freescale Semiconductor
101
PRELIMINARY
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