MC9S08AC60CFDE Freescale Semiconductor, MC9S08AC60CFDE Datasheet - Page 31
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MC9S08AC60CFDE
Manufacturer Part Number
MC9S08AC60CFDE
Description
IC MCU 8BIT 60K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08AC60CFJE.pdf
(348 pages)
Specifications of MC9S08AC60CFDE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
38
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Processor Series
S08AC
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Controller Family/series
HCS08
No. Of I/o's
38
Ram Memory Size
2KB
Cpu Speed
40MHz
No. Of Timers
3
Rohs Compliant
Yes
Height
1 mm
Length
7 mm
Supply Voltage (max)
5.5 V, 5.5 V
Supply Voltage (min)
2.7 V, 2.7 V
Width
7 mm
For Use With
DEMO9S08AC60E - BOARD DEMO FOR MC9S08A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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2.3.1
V
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there
should be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage
for the overall system and a 0.1-μF ceramic bypass capacitor located as near to the paired V
power pins as practical to suppress high-frequency noise. The MC9S08AC60 has a second V
pin should be connected to the system ground plane or to the primary V
connection.
V
the ADC module. A 0.1-μF ceramic bypass capacitor should be located as near to the analog power pins
as practical to suppress high-frequency noise.
2.3.2
Out of reset the MCU uses an internally generated clock (self-clocked mode — f
about 8-MHz crystal rate. This frequency source is used during reset startup and can be enabled as the
clock source for stop recovery to avoid the need for a long crystal startup delay. This MCU also contains
a trimmable internal clock generator (ICG) module that can be used to run the MCU. For more information
on the ICG, see
The oscillator in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic resonator in
either of two frequency ranges selected by the RANGE bit in the ICGC1 register. Rather than a crystal or
ceramic resonator, an external oscillator can be connected to the EXTAL input pin.
Refer to
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R
value is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity
and lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when sizing C1 and C2. The crystal manufacturer typically specifies a load capacitance which
is the series combination of C1 and C2 which are usually the same size. As a first-order approximation,
use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin (EXTAL and
XTAL).
2.3.3
RESET is a dedicated pin with a pullup device built in. It has input hysteresis, a high current output driver,
and no output slew rate control. Internal power-on reset and low-voltage reset circuitry typically make
Freescale Semiconductor
F
DD
DDAD
is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup and its
and V
and V
Figure 2-5
Power (V
Oscillator (XTAL, EXTAL)
RESET Pin
SS
SSAD
are the primary power supply pins for the MCU. This voltage source supplies power to all
Chapter 10, “Internal Clock Generator
are the analog power supply pins for the MCU. This voltage source supplies power to
for the following discussion. R
DD
, V
SS
, V
MC9S08AC60 Series Data Sheet, Rev. 2
DDAD
, V
SSAD
S
(when used) and R
)
(S08ICGV4).”
F
SS
should be low-inductance
pin through a low-impedance
Chapter 2 Pins and Connections
Self_reset
) equivalent to
DD
SS
and V
pin. This
SS
31
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