D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 142

• Manufacturer Part Number: D12312SVTEBL25
• Description: IC H8S MCU ROMLESS 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12312SVTEBL25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412312SVTEBL25; HD6412312SVTEBL25

Section 2 Instruction Descriptions
2.2.35 (4)
LDC (LoaD to Control register)
Operation
(EAs)
Assembly-Language Format
LDC.W <EAs>, EXR
Operand Size
Word
Description
This instruction loads the source operand contents into the extended control register (EXR).
Although EXR is a byte register, the source operand is word size. The contents of the even address
are loaded into EXR.
No interrupt requests, including NMI, are accepted for three states after execution of this
instruction.
Available Registers
ERs: ER0 to ER7
Rev. 4.00 Feb 24, 2006 page 126 of 322
REJ09B0139-0400
EXR
LDC (W)
Condition Code
H: Previous value remains unchanged.
N: Previous value remains unchanged.
Z: Previous value remains unchanged.
V: Previous value remains unchanged.
C: Previous value remains unchanged.
—
I
UI H
—
—
—
U
—
N
—
Z
— —
V
Load EXR
C