D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 248

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Section 2 Instruction Descriptions
STMAC (STore from MAC register)
Operand Format and Number of States Required for Execution
Note: * A maximum of three additional states are required for execution of this instruction within three states
Notes
Rev. 4.00 Feb 24, 2006 page 232 of 322
REJ09B0139-0400
Register direct
Register direct
Addressing
Mode
after execution of a MAC instruction. For example, if there is a one-state instruction (such as NOP)
between the MAC instruction and this instruction, this instruction will be two states longer.
The number of states may differ depending on the product. For details, refer to the relevant
microcontroller hardware manual of the product in question.
Mnemonic
STMAC
STMAC
MACH, ERd
MACL, ERd
Operands
1st byte
0
0
2
2
2nd byte
2
3
Instruction Format
0 erd
0 erd
Store Data from MAC Register
3rd byte
4th byte
States
No. of
1*
1*

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