D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 245

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
2.2.63
STM (STore from Multiple registers)
Operation
ERn (register list)
Assembly-Language Format
STM.L <register list>, @–SP
Operand Size
Longword
Description
This instruction saves a group of registers specified by a register list onto the stack. The registers
are saved in ascending order of register number.
Two, three, or four registers can be saved by one STM instruction. The following ranges can be
specified in the register list.
Two registers: ER0–ER1, ER2–ER3, ER4–ER5, or ER6–ER7
Three registers: ER0–ER2 or ER4–ER6
Four registers: ER0–ER3 or ER4–ER7
Available Registers
ERn: ER0 to ER7
STM
@–SP
Condition Code
H: Previous value remains unchanged.
N: Previous value remains unchanged.
Z: Previous value remains unchanged.
V: Previous value remains unchanged.
C: Previous value remains unchanged.
Rev. 4.00 Feb 24, 2006 page 229 of 322
I
UI H
Section 2 Instruction Descriptions
U
N
Store Data on Stack
REJ09B0139-0400
Z
— —
V
C

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