D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 73

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
2.2.5 (2)
ANDC (AND Control register)
Operation
EXR
Assembly-Language Format
ANDC #xx:8, EXR
Operand Size
Byte
Description
This instruction ANDs the contents of the extended control register (EXR) with immediate data
and stores the result in the extended control register. No interrupt requests, including NMI, are
accepted for three states after execution of this instruction.
Operand Format and Number of States Required for Execution
Notes
Immediate
Addressing
Mode
#IMM
ANDC
EXR
Mnemonic
ANDC
#xx:8, EXR
Operands
1st byte
0
1
Condition Code
H: Previous value remains unchanged.
N: Previous value remains unchanged.
Z: Previous value remains unchanged.
V: Previous value remains unchanged.
C: Previous value remains unchanged.
2nd byte
4
Instruction Format
I
Rev. 4.00 Feb 24, 2006 page 57 of 322
1
UI H
Section 2 Instruction Descriptions
3rd byte
0
U
6
Logical AND with EXR
N
4th byte
REJ09B0139-0400
IMM
Z
— —
V
States
No. of
C
2

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