D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 23

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Stack Structure: When the program counter (PC) is pushed onto the stack in a subroutine call,
and the PC, condition-code register (CCR), and extended control register (EXR) are pushed onto
the stack in exception handling, they are stored as shown in figure 1.3. When EXR is invalid, it is
not pushed onto the stack. For details, see the relevant hardware manual.
(2) Advanced Mode
In advanced mode the data address space is larger than for the H8/300H CPU.
Address Space: The 4-Gbyte maximum address space provides linear access to a maximum
16 Mbytes of program code and maximum 4 Gbytes of data.
Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as
the upper 16-bit segments of 32-bit registers or address registers.
Instruction Set: All instructions and addressing modes can be used.
SP
Notes: 1.
(a) Subroutine Branch
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored on return.
(16 bits)
Figure 1.3 Stack Structure in Normal Mode
PC
(SP
SP
*2
Rev. 4.00 Feb 24, 2006 page 7 of 322
)
(b) Exception Handling
Reserved
(16 bits)
CCR
EXR
CCR
PC
*1
*3
*1 *3
REJ09B0139-0400
Section 1 CPU

Related parts for D12312SVTEBL25