D12312SVF20V Renesas Electronics America, D12312SVF20V Datasheet - Page 658

IC H8S/2312S MCU ROMLESS 100QFP

D12312SVF20V

Manufacturer Part Number
D12312SVF20V
Description
IC H8S/2312S MCU ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVF20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVF20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 ROM
FWE application/disconnection (see figures 17.30 to 17.32): FWE application should be carried
out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin
low and set the protection state.
The following points must be observed concerning FWE application and disconnection to prevent
unintentional programming or erasing of flash memory:
• Apply FWE when the V
• In boot mode, apply and disconnect FWE during a reset.
• In user program mode, FWE can be switched between high and low level regardless of the
• Do not apply FWE if program runaway has occurred.
• Disconnect FWE only when the SWE, ESU, PSU, EV, PV, P, and E bits in FLMCR1 are
Do not apply a constant high level to the FWE pin: Apply a high level to the FWE pin only
when programming or erasing flash memory. A system configuration in which a high level is
constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the
FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due
to program runaway, etc.
Use the recommended algorithm when programming and erasing flash memory: The
recommended algorithm enables programming and erasing to be carried out without subjecting the
device to voltage stress or sacrificing program data reliability. When setting the P or E bit in
FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway,
etc.
Do not set or clear the SWE bit during execution of a program in flash memory: Wait for at
least 100 μs after clearing the SWE bit before executing a program or reading data in flash
memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1,
flash memory can only be read in program-verify or erase-verify mode. Access flash memory only
for verify operations (verification during programming/erasing). Also, do not clear the SWE bit
during programming, erasing, or verifying.
Similarly, when using the RAM emulation function while a high level is being input to the FWE
pin, the SWE bit must be cleared before executing a program or reading data in flash memory.
Rev.7.00 Feb. 14, 2007 page 624 of 1108
REJ09B0089-0700
Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization
time).
reset state. FWE input can also be switched during execution of a program in flash memory.
cleared.
Make sure that the SWE, ESU, PSU, EV, PV, P, and E bits are not set by mistake when
applying or disconnecting FWE.
CC
voltage has stabilized within its rated voltage range.

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