HD64F3664BPV Renesas Electronics America, HD64F3664BPV Datasheet - Page 112

MCU 3/5V 32K,PB-FREE 42-DIP

HD64F3664BPV

Manufacturer Part Number
HD64F3664BPV
Description
MCU 3/5V 32K,PB-FREE 42-DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3664BPV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
29
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
42-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Section 5 Clock Pulse Generators
5.4
5.4.1
Resonator characteristics are closely related to board design and should be carefully evaluated by
the user, referring to the examples shown in this section. Resonator circuit constants will differ
depending on the resonator element, stray capacitance in its interconnecting circuit, and other
factors. Suitable constants should be determined in consultation with the resonator element
manufacturer. Design the circuit so that the resonator element never receives voltages exceeding
its maximum rating.
5.4.2
When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as
close as possible to the OSC
resonator circuit to prevent induction from interfering with correct oscillation (see figure 5.11).
Rev. 6.00 Mar. 24, 2006 Page 82 of 412
REJ09B0142-0600
Usage Notes
Note on Resonators
Notes on Board Design
Figure 5.11 Example of Incorrect Board Design
1
Avoid
and OSC
OSC
OSC
2
pins. Other signal lines should be routed away from the
1
2
Signal A
Signal B
C
C
1
2

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