HD64F3664BPV Renesas Electronics America, HD64F3664BPV Datasheet - Page 55

MCU 3/5V 32K,PB-FREE 42-DIP

HD64F3664BPV

Manufacturer Part Number
HD64F3664BPV
Description
MCU 3/5V 32K,PB-FREE 42-DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3664BPV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
29
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
42-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 2.2
Note: * Refers to the operand size.
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
B: Byte
W: Word
L: Longword
Data Transfer Instructions
Size*
B/W/L
B
B
W/L
W/L
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
(EAs) → Rd, Cannot be used in this LSI.
Rs → (EAs) Cannot be used in this LSI.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
Rev. 6.00 Mar. 24, 2006 Page 25 of 412
REJ09B0142-0600
Section 2 CPU

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