HD64F3664BPV Renesas Electronics America, HD64F3664BPV Datasheet - Page 113

MCU 3/5V 32K,PB-FREE 42-DIP

HD64F3664BPV

Manufacturer Part Number
HD64F3664BPV
Description
MCU 3/5V 32K,PB-FREE 42-DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3664BPV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
29
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
42-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
This LSI has six modes of operation after a reset. These include a normal active mode and four
power-down modes, in which power consumption is significantly reduced. Module standby mode
reduces power consumption by selectively halting on-chip module functions.
• Active mode
• Subactive mode
• Sleep mode
• Subsleep mode
• Standby mode
• Module standby mode
The CPU and all on-chip peripheral modules are operable on the system clock. The system
clock frequency can be selected from φosc, φosc/8, φosc/16, φosc/32, and φosc/64.
The CPU and all on-chip peripheral modules are operable on the subclock. The subclock
frequency can be selected from φw/2, φw/4, and φw/8.
The CPU halts. On-chip peripheral modules are operable on the system clock.
The CPU halts. On-chip peripheral modules are operable on the subclock.
The CPU and all on-chip peripheral modules halt. When the clock time-base function is
selected, timer A is operable.
Independent of the above modes, power consumption can be reduced by halting on-chip
peripheral modules that are not used in module units.
Section 6 Power-Down Modes
Rev. 6.00 Mar. 24, 2006 Page 83 of 412
Section 6 Power-Down Modes
REJ09B0142-0600

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