HD64F3664BPV Renesas Electronics America, HD64F3664BPV Datasheet - Page 356

MCU 3/5V 32K,PB-FREE 42-DIP

HD64F3664BPV

Manufacturer Part Number
HD64F3664BPV
Description
MCU 3/5V 32K,PB-FREE 42-DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3664BPV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
29
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
42-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Section 20 Electrical Characteristics
20.2.6
Table 20.8 Flash Memory Characteristics
V
Rev. 6.00 Mar. 24, 2006 Page 326 of 412
REJ09B0142-0600
Item
Programming time (per 128 bytes)*
Erase time (per block) *
Reprogramming count
Programming Wait time after SWE
CC
= 3.0 V to 5.5 V, V
Memory Characteristics
bit setting*
Wait time after PSU
bit setting*
Wait time after P bit setting*
Wait time after P bit clear*
Wait time after PSU bit clear*
Wait time after PV bit setting*
Wait time after dummy write*
Wait time after PV bit clear*
Wait time after SWE bit clear*
Maximum
programming count*
1
*
3
SS
*
1
1
6
= 0.0 V, T
1
*
1
*
2
*
4
*
4
a
5
= –20°C to +75°C, unless otherwise specified.
1
1
1
*
1
1
1
4
1
Symbol Condition
t
t
N
x
y
z1
z2
z3
α
β
γ
ε
η
θ
N
P
E
WEC
Test
1 ≤ n ≤ 6
7 ≤ n ≤ 1000
Additional-
programming
Min
1000
1
50
28
198
8
5
5
4
2
2
100
Typ
7
100
10000
30
200
10
Values
Max
200
1200
32
202
12
1000
Unit
ms
ms
Times
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
Times

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