DF2367VTE33 Renesas Electronics America, DF2367VTE33 Datasheet - Page 898

• Manufacturer Part Number: DF2367VTE33
• Description: IC H8S MCU FLASH 384K 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VTE33; HD64F2367VTE33

Section 23 Power-Down Modes
23.4.6
The following points should be noted in clock division mode.
• Select the clock division ratio specified by the SCK2 to SCK0 bits so that the frequency of φ is
• All the on-chip peripheral modules operate on the φ. Therefore, note the time processing of
• Note that the frequency of φ will be changed by changing the clock division ratio.
Rev.6.00 Mar. 18, 2009 Page 838 of 980
REJ09B0050-0600
within the operation guaranteed range of clock cycle time (t
Characteristics. In other words, the range of φ must be specified to 8 MHz (min.); outside of
this range (φ < 8 MHz) must be prevented.
modules such as a timer and SCI differ before and after changing the clock division ratio. In
addition, wait time for clearing software standby mode differs by changing the clock division
ratio.
Notes on Clock Division Mode
cyc
) shown in the Electrical