UPD70F3744GJ-GAE-AX Renesas Electronics America, UPD70F3744GJ-GAE-AX Datasheet - Page 204
UPD70F3744GJ-GAE-AX
Manufacturer Part Number
UPD70F3744GJ-GAE-AX
Description
MCU 32BIT V850ES/JX3 144-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet
1.UPD70F3743GJ-GAE-AX.pdf
(911 pages)
Specifications of UPD70F3744GJ-GAE-AX
Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
128
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD70F3744GJ-GAE-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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V850ES/JJ3
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
Note This idle state (TI) does not depend on the BCC register settings.
Remarks 1. See Table 2-2 for the pin statuses in the bus hold mode.
AD15 to AD0
CS3 to CS0
A23 to A16
CLKOUT
HLDRQ
HLDAK
ASTB
RD
2. The broken lines indicate high impedance.
Figure 5-8. Multiplexed Bus Hold Timing (Bus Size: 16 Bits, 16-Bit Access)
T1
A1
T2
A1
D1
T3
Undefined
Undefined
1111
TI
Note
TH
TH
TH
CHAPTER 5 BUS CONTROL FUNCTION
TH
Undefined
Undefined
1111
TI
Note
A2
T1
D2
T2
A2
Page 188 of 892
T3
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