FSBB15CH60C Fairchild Semiconductor, FSBB15CH60C Datasheet - Page 45

• Manufacturer Part Number: FSBB15CH60C
• Description: IC POWER MOD SPM 600V SPM27CC
• Manufacturer: Fairchild Semiconductor
• Series: SPM™r
• Type: IGBTr

Specifications of FSBB15CH60C

• Configuration: 3 Phase
• Current: 15A
• Voltage: 600V
• Voltage - Isolation: 2500Vrms
• Package / Case: SPM27CC
• Transistor Polarity: N Channel
• Dc Collector Current: 15A
• Collector Emitter Voltage Vces: 2V
• Power Dissipation Pd: 55W
• Collector Emitter Voltage V(br)ceo: 600V
• Operating Temperature Range: -40°C To
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Pin Count: 27
• Mounting: Through Hole
• Case Length: 44mm
• Case Height: 5.5mm
• Screening Level: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

dissipation per device, junction temperature and case reference temperature, respectively. By replacing T
with T
a serial summation of various thermal resistances, R
sink, and R
minimizing R
as well as the minimizing of R
the case temperature T
proportional to the thermal grease thickness and governed by the skill at the assembly site, while R
handled to some extent by selecting an appropriate heat sink.
in Fig. 9.1 should be considered. For pulsed power loss, the thermal capacitance effect delays the rise in
junction temperature, and thus permits a heavier loading of the SPM. Figure 9.2 shows the normalized
thermal impedance curves of FSBB30CH60C, FSBB15CH60C, FSBF10CH60B and FSBF3CH60B. The
2008-03-03
a
The thermal resistance of the SPM is defined in the following equation,
where R
where R
where R
In practical operation, the power loss P
(ambient temperature), the junction-to-ambient thermal resistance R
θ ha
θ ch
θ ja
θ ch
θ jc
and R
is heat sink thermal resistance, respectively. From the equation (9.13), it is clear that
(
is contact thermal resistance due to the thermal grease between the package and the heat
o
P
indicates the total thermal performance of the SPM including the heat sink. Basically R
C/W) is the junction-to-case thermal resistance, and P
D
θ ha
Figure 9.1 Transient thermal equivalent circuit with a heatsink.
c
is an essential application factor to maximize the power carrying ability of the SPM
is locked at the fixed ambient temperature T
T
Being ignored
j
θ jc
itself. An infinite heat sink will result if R
C
jc
R
R
R
θ
θ
θ jc
R
ja
jc
θ
R
ja
=
=
θ ca
D
=
R
T
is cyclic and therfore the transient RC equivalent circuit shown
θ
T
j
T
Transient impedance
jc
V4 Mini DIP SPM Application Note (2008-03-03)
P
c
−
j
D
+
P
of each section
−
T
θ jc
D
45
R
c
T
, R
θ
FAIRCHILD SEMICONDUCTOR - Smart Power Module
a
C
ch
θ ch
ch
+
R
and R
R
θ ch
θ
ha
θ ha
T
.
h
θ ch
D
(W), T
θ ja
and R
a
C
. Usually, the value of R
can be obtained as following,
ha
R
j
θ ha
θ ha
(
o
C) and T
are reduced to zero and
T
a
c
(
o
C) are power
θ ha
can be
(9.12)
(9.13)
(9.11)
θ ch
θ ja
is
is
c