FSBB15CH60C Fairchild Semiconductor, FSBB15CH60C Datasheet - Page 57

• Manufacturer Part Number: FSBB15CH60C
• Description: IC POWER MOD SPM 600V SPM27CC
• Manufacturer: Fairchild Semiconductor
• Series: SPM™r
• Type: IGBTr

Specifications of FSBB15CH60C

• Configuration: 3 Phase
• Current: 15A
• Voltage: 600V
• Voltage - Isolation: 2500Vrms
• Package / Case: SPM27CC
• Transistor Polarity: N Channel
• Dc Collector Current: 15A
• Collector Emitter Voltage Vces: 2V
• Power Dissipation Pd: 55W
• Collector Emitter Voltage V(br)ceo: 600V
• Operating Temperature Range: -40°C To
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Pin Count: 27
• Mounting: Through Hole
• Case Length: 44mm
• Case Height: 5.5mm
• Screening Level: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.2 Handling Precaution
improper handling may result in significant deterioration of their electrical characteristics and/or reliability.
2008-03-03
Transportation
drop. During transport, ensure that the device is not subjected to mechanical vibration or shock. Avoid
getting devices wet. Moisture can also adversely affect the packaging (by nullifying the effect of the
antistatic agent). Place the devices in special conductive trays. When handling devices, hold the package
and avoid touching the leads, especially the gate terminal. Put package boxes in the correct direction.
Putting them upside down, leaning them or giving them uneven stress might cause the electrode terminals
to be deformed or the resin case to be damaged. Throwing or dropping the packaging boxes might cause
the devices to be damaged. Wetting the packaging boxes might cause the breakdown of devices when
operating. Pay attention not to wet them when transporting on a rainy or a snowy day.
Storage
Handle the device and packaging material with care. To avoid damage to the device, do not toss or
1) Avoid locations where devices will be exposed to moisture or direct sunlight. (Be especially careful
2) Do not place the device cartons upside down. Stack the cartons atop one another in an uprighrt
3) The storage area temperature should be maintained within a range of 5
4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Rapid temperature changes can
When using semiconductors, the incidence of thermal and/or mechanical stress to the devices due to
during periods of rain or snow.)
position only. : Do not place cartons on their sides.
within the range from 40% to 75%.
cause moisture condensation on stored devices, resulting in lead oxidation or corrosion. As a result,
Figure 10.1 Flatness measurement position
V4 Mini DIP SPM Application Note (2008-03-03)
( + )
( + )
57
FAIRCHILD SEMICONDUCTOR - Smart Power Module
( + )
° C
to 35
° C
, with humidity kept