FSBB15CH60C Fairchild Semiconductor, FSBB15CH60C Datasheet - Page 48

• Manufacturer Part Number: FSBB15CH60C
• Description: IC POWER MOD SPM 600V SPM27CC
• Manufacturer: Fairchild Semiconductor
• Series: SPM™r
• Type: IGBTr

Specifications of FSBB15CH60C

• Configuration: 3 Phase
• Current: 15A
• Voltage: 600V
• Voltage - Isolation: 2500Vrms
• Package / Case: SPM27CC
• Transistor Polarity: N Channel
• Dc Collector Current: 15A
• Collector Emitter Voltage Vces: 2V
• Power Dissipation Pd: 55W
• Collector Emitter Voltage V(br)ceo: 600V
• Operating Temperature Range: -40°C To
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Pin Count: 27
• Mounting: Through Hole
• Case Length: 44mm
• Case Height: 5.5mm
• Screening Level: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Then the voltage drop across the junction is measured as a function of the junction temperatures. The
amount of sense current should be small enough not to heat the DUT, for instance, 1 mA, 10 mA depending
on the device type. The measurements are repeated over a specific temperature range with some specified
temperature steps. Figure 9.4 shows a typical result.
expressed as shown in the following equation.
relationship. The reciprocal of the slope is often referred to as the "K factor (V/
TSP. For semiconductor junctions, the slope m of the calibrating straight line in Fig. 9.4 is always negative,
i.e., the forward conduction voltage decreases with increasing junction temperature. This process of
obtaining equation (9.14) is called the calibration procedure for a given device.
measuring the voltage drop at a given sense current during the calibration procedure and by using equation
(9.14). The TSP varies from device to device, since a specific device does not have the diode voltage TSP.
But the transistor saturation voltage can be used in that case. For instance, the gate turn-on voltage can be
used as the TSP for an IGBT or a MOSFET.
9.2.3 Measurement Procedures
DUT. The continuous power heats up the DUT to a thermally equilibrated state. While the device is heating, a
continuous train of sampling pulses monitors the TSP, i.e., the voltage drop or the same as the junction
2008-03-03
When the DUT attains thermal equilibrium with the hot fluid, a sense current is applied to the junction.
The relationship between the junction temperature and voltage drop at a given temperature can be
The slope, m(
During the thermal resistance measurement test, the junction temperature can be estimated by
The thermal resistance test begins by applying a continuous power of known current and voltage to the
℃
Figure 9.4 Typical example of a TSP Plot with constant sense current
/V) and the temperature ordinate-intercept, T
T
j
T
j
=
V4 Mini DIP SPM Application Note (2008-03-03)
m
∗
48
V
T
FAIRCHILD SEMICONDUCTOR - Smart Power Module
X
j
=m*V
+
T
o
X
+T
V
X
o
(V) are used to quantify this straight line
o
o
C) ". In this case, V
f
(V) is the
(9.14)