XR20M1172IL32-F Exar Corporation, XR20M1172IL32-F Datasheet - Page 5

• Manufacturer Part Number: XR20M1172IL32-F
• Description: IC UART FIFO I2C/SPI 64B 32QFN
• Manufacturer: Exar Corporation

Specifications of XR20M1172IL32-F

• Number Of Channels: 2, DUART
• Package / Case: 32-VFQFN Exposed Pad
• Features: *
• Fifo's: 64 Byte
• Protocol: RS485
• Voltage - Supply: 1.62 V ~ 3.63 V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Data Rate: 16 Mbps
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.62 V
• Supply Current: 250 uA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• No. Of Channels: 2
• Uart Features: Tx/Rx FIFO Counters
• Supply Voltage Range: 1.62V To 3.63V
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: QFN
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

REV. 1.0.1
Pin Description
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
GPIO7/RIA#
I2C/SPI#
A0/CS#
N
A1/SI
VCC
NC
AME
-
32-QFN
P
PAD
1, 8
28
29
30
31
32
IN
#
28-TSSOP
P
28
IN
1
2
3
4
-
-
#
T
Pwr
Pwr
I/O
YPE
I
I
I
-
General purpose I/O pin or UART Ring-Indicator. If this pin is an input
and is unused, it should be connected to VCC or GND. If this pin is an
output and is unused, it should be left unconnected. See IOControl[1]
and IODir register.
1.62V to 3.63V power supply.
I
uration is selected, this pin along with the A1 pin allows user to change
the device’s base address. If SPI configuration is selected, this pin is
the SPI chip select pin (Schmitt-trigger, active LOW).
I
onfiguration is selected, this pin along with A0 pin allows user to
change the device’s base address. If SPI configuration is selected,
this pin is the SPI data input pin.
I
is HIGH. SPI interface is selected if this pin is LOW
The center pad on the backside of the QFN package is metallic and is
not electrically connected to anything inside the device. It must be sol-
dered on to the PCB and may be optionally connected to GND on the
PCB. The thermal pad size on the PCB should be the approximate
size of this center pad and should be solder mask defined. The solder
mask opening should be at least 0.0025" inwards from the edge of the
PCB thermal pad.
No Connection.
2
2
2
C-bus device address select A0 or SPI chip select. If I
C-bus device address select A1 or SPI data input pin. If I
C-bus or SPI interface select. I
5
TWO CHANNEL I2C/SPI UART WITH 64-BYTE FIFO
D
ESCRIPTION
2
C-bus interface is selected if this pin
XR20M1172
2
C-bus config-
2
C-bus