XC3SD3400A-4FGG676C Xilinx Inc, XC3SD3400A-4FGG676C Datasheet - Page 65

• Manufacturer Part Number: XC3SD3400A-4FGG676C
• Description: FPGA, SPARTAN-3A, DSP, 676FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3A DSPr

Specifications of XC3SD3400A-4FGG676C

• No. Of Logic Blocks: 5968
• No. Of Gates: 3400000
• No. Of Macrocells: 53712
• Family Type: Spartan-3A
• No. Of Speed Grades: 4
• Total Ram Bits: 2322432
• No. Of I/o's: 502
• Clock Management: DCM
• I/o Supply: RoHS Compliant
• Number Of Logic Elements/cells: 53712
• Number Of Labs/clbs: 5968
• Number Of I /o: 469
• Number Of Gates: 3400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• Package: 676FBGA
• Family Name: Spartan®-3A
• Device Logic Units: 53712
• Device System Gates: 3400000
• Maximum Internal Frequency: 667 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 469
• Ram Bits: 2322432
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 122-1532 - KIT DEVELOPMENT SPARTAN 3ADSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1539

Package Thermal Characteristics
The power dissipated by an FPGA application has implications on package selection and system design. The power
consumed by a Spartan-3A DSP FPGA is reported using either the
calculator integrated in the Xilinx ISE® development software.
Spartan-3A DSP device package offerings. This information is also available using the
The junction-to-case thermal resistance (θ
body (case) and the die junction temperature per watt of power consumption. The junction-to-board (θ
reports the difference between the board and junction temperature. The junction-to-ambient (θ
temperature difference between the ambient environment and the junction temperature. The θ
different air velocities, measured in linear feet per minute (LFM). The “Still Air (0 LFM)” column shows the θ
system without a fan. The thermal resistance drops with increasing air flow.
Table 62: Spartan-3A DSP FPGA Package Thermal Characteristics
DS610 (v3.0) October 4, 2010
Product Specification
Package
CSG484
FGG676
CS484
FG676
XC3SD1800A
XC3SD3400A
XC3SD1800A
XC3SD3400A
Device
Junction-to-Case
(θ
4.1
3.5
4.7
3.8
JC
)
JC
) indicates the difference between the temperature measured on the package
Junction-to-
Board (θ
www.xilinx.com
6.8
5.6
7.8
6.4
JB
)
Table 62
(0 LFM)
Still Air
Spartan-3A DSP FPGA Family: Pinout Descriptions
XPower Power Estimator
18.0
16.9
15.9
14.7
provides the thermal characteristics for the various
Junction-to-Ambient (θ
at Different Air Flows
250 LFM
13.3
12.2
11.6
10.5
Thermal Query
500 LFM
12.3
11.0
10.6
9.4
or the
JA
JA
) value reports the
value is reported at
JA
XPower Analyzer
)
750 LFM
JB
tool.
11.5
10.4
10.0
) value similarly
8.9
JA
value in a
Units
°C/W
°C/W
°C/W
°C/W
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