STPCC5HEBC STMicroelectronics, STPCC5HEBC Datasheet - Page 60

• Manufacturer Part Number: STPCC5HEBC
• Description: IC SYSTEM-ON-CHIP X86 388-PBGA
• Manufacturer: STMicroelectronics
• Series: -r

Specifications of STPCC5HEBC

• Applications: Set-Top Boxes, TV
• Core Processor: x86
• Program Memory Type: External Program Memory
• Controller Series: STPC® Consumer-II
• Ram Size: External
• Interface: EBI/EMI, I²C, IDE, ISA, Local Bus
• Number Of I /o: -
• Voltage - Supply: 2.45 V ~ 3.6 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: *
• Package / Case: *
• Lead Free Status / RoHS Status: Not Compliant

MECHANICAL DATA
5.2. 388-PIN PACKAGE THERMAL DATA
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
60/93
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Figure 5-5. Thermal Dissipation Without Heatsink
Rca
Rjc
Rjb
Rba
Figure 5-4. 388-Pin PBGA structure
Board
Release 1.5 - January 29, 2002
8.5
Rja = 13 °C/W
6
Junction
Ambient
Thermal balls
6
125
Case
The structure in shown in
Thermal dissipation options are illustrated in
Figure 5-5
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the centrecentre ba
and
Figure
Power & Ground layers
5-6.
Figure
5-4.