MC9S08GT60ACFDE Freescale, MC9S08GT60ACFDE Datasheet - Page 18
MC9S08GT60ACFDE
Manufacturer Part Number
MC9S08GT60ACFDE
Description
Manufacturer
Freescale
Datasheet
1.MC9S08GT60ACFDE.pdf
(302 pages)
Specifications of MC9S08GT60ACFDE
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
39
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8/2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
QFN EP
Program Memory Type
Flash
Program Memory Size
60KB
Lead Free Status / RoHS Status
Compliant
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Chapter 1 Device Overview
1.2.2
18
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On-chip in-circuit programmable flash memory:
— Fully read/write functional across voltage and temperature ranges
— Block protection and security options
— (see
On-chip random-access memory (RAM) (see
8-channel, 10-bit analog-to-digital converter (ATD)
Two serial communications interface modules (SCI)
Serial peripheral interface module (SPI)
Multiple clock source options:
— Internally generated clock with ±0.2% trimming resolution and ±0.5% deviation across voltage
— Crystal
— Resonator
— External clock
Inter-integrated circuit bus module to operate up to 100 kbps (IIC)
One 3-channel and one 5-channel 16-bit timer/pulse width modulator (TPM) modules with
selectable input capture, output compare, and edge-aligned PWM capability on each channel. Each
timer module may be configured for buffered, centered PWM (CPWM) on all channels (TPMx).
8-pin keyboard interrupt module (KBI)
16 high-current pins (limited by package dissipation)
Software selectable pullups on ports when used as input. Selection is on an individual port bit basis.
During output mode, pullups are disengaged.
Internal pullup on RESET and IRQ pin to reduce customer system cost
Up to 56 general-purpose input/output (I/O) pins, depending on package selection
64-pin low-profile quad flat package (LQFP) — MC9S08GBxxA
48-pin quad flat package, no lead (QFN) — MC9S08GTxxA
44-pin quad flat package (QFP) — MC9S08GTxxA
42-pin skinny dual in-line package (SDIP) — MC9S08GTxxA
Features of MC9S08GBxxA/GTxxA Series of MCUs
Table 1-1
for device-specific information)
MC9S08GB60A Data Sheet, Rev. 2
Table 1-1
for device specific information)
Freescale Semiconductor
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