MC9S08GT60ACFDE Freescale, MC9S08GT60ACFDE Datasheet - Page 245

MC9S08GT60ACFDE

Manufacturer Part Number
MC9S08GT60ACFDE
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08GT60ACFDE

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
39
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8/2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
QFN EP
Program Memory Type
Flash
Program Memory Size
60KB
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08GT60ACFDE
Manufacturer:
NXP
Quantity:
1 000
Part Number:
MC9S08GT60ACFDE
Manufacturer:
NXP
Quantity:
1 000
Figure 15-4
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the
target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low
for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit
level about 10 cycles after starting the bit time.
Freescale Semiconductor
SPEED-UP PULSE
PERCEIVED START
TO BKGD PIN
TARGET MCU
(TARGET MCU)
HOST DRIVE
DRIVE AND
BDC CLOCK
OF BIT TIME
BKGD PIN
shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is
Figure 15-4. BDM Target-to-Host Serial Bit Timing (Logic 0)
MC9S08GB60A Data Sheet, Rev. 2
10 CYCLES
HOST SAMPLES BKGD PIN
10 CYCLES
HIGH-IMPEDANCE
SPEEDUP
PULSE
EARLIEST START
OF NEXT BIT
Development Support
245

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