MT41J256M8HX-15E IT:D Micron Technology Inc, MT41J256M8HX-15E IT:D Datasheet - Page 6

• Manufacturer Part Number: MT41J256M8HX-15E IT:D
• Description: MICMT41J256M8HX-15E_IT:D 2GB DDR3 SDRAM
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr

Specifications of MT41J256M8HX-15E IT:D

• Organization: 256Mx8
• Address Bus: 18b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: -40C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 165mA
• Pin Count: 78
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

List of Tables
Table 1: Key Timing Parameters ...................................................................................................................... 1
Table 2: Addressing ......................................................................................................................................... 2
Table 3: 78-Ball FBGA – x4, x8 Ball Descriptions .............................................................................................. 19
Table 4: 82-Ball FBGA (x4, x8) ........................................................................................................................ 21
Table 5: 96-Ball FBGA – x16 Ball Descriptions ................................................................................................. 23
Table 6: Absolute Maximum Ratings .............................................................................................................. 29
Table 7: Input/Output Capacitance ............................................................................................................... 30
Table 8: Thermal Characteristics .................................................................................................................... 31
Table 9: Timing Parameters Used for I
Table 10: I
Table 11: I
Table 12: I
Table 13: I
Table 14: I
Table 15: I
Table 16: I
Table 17: I
Table 18: I
Table 19: I
Table 20: I
Table 21: I
Table 22: I
Table 23: DC Electrical Characteristics and Operating Conditions ................................................................... 48
Table 24: DC Electrical Characteristics and Input Conditions .......................................................................... 48
Table 25: Input Switching Conditions ............................................................................................................ 49
Table 26: Control and Address Pins ................................................................................................................ 51
Table 27: Clock, Data, Strobe, and Mask Pins ................................................................................................. 51
Table 28: Differential Input Operating Conditions (CK, CK# and DQS, DQS#) .................................................. 52
Table 29: Allowed Time Before Ringback (
Table 30: Single-Ended Input Slew Rate Definition ......................................................................................... 54
Table 31: Differential Input Slew Rate Definition ............................................................................................ 56
Table 32: On-Die Termination DC Electrical Characteristics ........................................................................... 57
Table 33: R
Table 34: ODT Sensitivity Definition .............................................................................................................. 59
Table 35: ODT Temperature and Voltage Sensitivity ....................................................................................... 59
Table 36: ODT Timing Definitions ................................................................................................................. 60
Table 37: Reference Settings for ODT Timing Measurements .......................................................................... 60
Table 38: 34 Ohm Driver Impedance Characteristics ...................................................................................... 64
Table 39: 34 Ohm Driver Pull-Up and Pull-Down Impedance Calculations ...................................................... 65
Table 40: 34 Ohm Driver I
Table 41: 34 Ohm Driver I
Table 42: 34 Ohm Driver I
Table 43: 34 Ohm Output Driver Sensitivity Definition ................................................................................... 66
Table 44: 34 Ohm Output Driver Voltage and Temperature Sensitivity ............................................................ 66
Table 45: 40 Ohm Driver Impedance Characteristics ...................................................................................... 67
Table 46: 40 Ohm Output Driver Sensitivity Definition ................................................................................... 67
Table 47: 40 Ohm Output Driver Voltage and Temperature Sensitivity ............................................................ 68
Table 48: Single-Ended Output Driver Characteristics .................................................................................... 69
Table 49: Differential Output Driver Characteristics ....................................................................................... 70
Table 50: Single-Ended Output Slew Rate Definition ...................................................................................... 72
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
DD0
DD1
DD
DD2N
DD2NT
DD4R
DD4W
DD5B
DD
DD7
DD
DD
DD
TT
Measurement Conditions for Power-Down Currents .................................................................. 35
Measurement Conditions for I
Maximum Limits – Die Rev A ..................................................................................................... 43
Maximum Limits – Die Rev D .................................................................................................... 45
Maximum Limits – Die Rev H .................................................................................................... 47
Effective Impedances ................................................................................................................ 58
Measurement Loop ................................................................................................................. 33
Measurement Loop ................................................................................................................. 34
Measurement Loop ................................................................................................................. 41
Measurement Loop ................................................................................................................ 37
Measurement Loop ................................................................................................................ 39
and I
Measurement Loop ............................................................................................................... 38
Measurement Loop .............................................................................................................. 36
DD3N
OH
OH
OH
Measurement Loop ................................................................................................ 36
/I
/I
/I
OL
OL
OL
Characteristics: V
Characteristics: V
Characteristics: V
DD
Measurements – Clock Units ........................................................... 32
t
DVAC) for CK - CK# and DQS - DQS# .............................................. 53
DD6
, I
DD6ET
DD
DD
DD
= V
= V
= V
, and I
6
DDQ
DDQ
DDQ
DD8
= 1.5V ................................................................ 65
= 1.575V ............................................................ 65
= 1.425V ............................................................ 66
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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2Gb: x4, x8, x16 DDR3 SDRAM
© 2006 Micron Technology, Inc. All rights reserved.