XPC8240LZU200E Freescale Semiconductor, XPC8240LZU200E Datasheet
XPC8240LZU200E
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XPC8240LZU200E Summary of contents
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... Freescale Semiconductor, Inc. Advance Information MPC8240EC Rev. 4, 11/2003 MPC8240 Integrated Processor Hardware Specifications The MPC8240 combines a MPC603e core microprocessor with a PCI bridge. The MPC8240 PCI support allows system designers to rapidly create systems using peripherals already designed for PCI and the other standard interfaces. The MPC8240 also integrates a high-performance memory controller that supports various types of DRAM and ROM ...
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... Freescale Semiconductor, Inc. Overview Overview MPC8240 Processor Core Block Additional Features: Processor • Prog I/O with Watchpoint PLL • JTAG/COP Interface • Power Management System Register Unit (SRU) Peripheral Logic Block Message Unit (with DMA Controller Controller PIC 5 IRQs/ Interrupt 16 Serial ...
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... Freescale Semiconductor, Inc. power management features. The integration reduces the overall packaging requirements and the number of discrete devices required for an embedded system. The MPC8240 contains an internal peripheral logic bus that interfaces the MPC603e core to the peripheral logic. The core can operate at a variety of frequencies, allowing the designer to trade off performance for power consumption ...
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... Freescale Semiconductor, Inc. Features Features – Address translation unit – Some internal configuration registers accessible from PCI — Two-channel integrated DMA controller (writes to ROM/Port X not supported) – Supports direct mode or chaining mode (automatic linking of DMA transfers) – Supports scatter gathering—Read or write discontinuous memory – ...
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... Freescale Semiconductor, Inc. 1.3 General Parameters The following list provides a summary of the general parameters of the MPC8240: Technology 0.29-µm CMOS, five-layer metal Die size 73 mm Transistor count 3.1 million Logic design Fully-static Packages Surface mount 352 tape ball grid array (TBGA) Core power supply 2.5 V ± ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics 1.4.1.2 Recommended Operating Conditions Table 2 provides the recommended operating conditions for the MPC8240. Table 2. Recommended Operating Conditions Characteristic Supply voltage Supply voltage for PCI and standard bus standards Supply voltages for memory bus drivers PLL supply voltage— ...
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... Freescale Semiconductor, Inc. Figure 2 shows the supply voltage sequencing and separation cautions 3 2 Voltage Regulator Delay Power Supply Ramp Up Reset Configuration Pins HRST_CPU and HRST_CTRL Notes: 1. Numbers associated with waveform separations correspond to caution numbers listed in Table 2. 2. Refer to Table 7 for additional information on PLL relock and reset signal assertion timing requirements. ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics Figure 3 shows the undershoot and overshoot voltage of the memory interface of the MPC8240 GND GND – 0 GND – 1.0 V Figure 3. Overshoot/Undershoot Voltage Figure 4 and Figure 5 show the undershoot and overshoot voltage of the PCI interface of the MPC8240 for the 3 ...
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... Freescale Semiconductor, Inc. Overvoltage Waveform Undervoltage Waveform Figure 5. Maximum AC Waveforms for 5-V Signaling 1.4.1.3 DC Electrical Specifications Table 3 provides the DC electrical characteristics for the MPC8240. Table 3. DC Electrical Specifications At recommended operating conditions (see Table 2) Characteristic 5 Input high voltage PCI only Input low voltage ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics Table 3. DC Electrical Specifications (continued) At recommended operating conditions (see Table 2) Characteristic Capacitance V Notes: 1. See Table 17 for pins with internal pull-up resistors. 2. See Table 4 for the typical drive capability of a specific signal pin based on the type of output driver associated with that pin as listed in Table 17 ...
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... Freescale Semiconductor, Inc. 1.4.1.5 Power Characteristics Table 5 provides power consumption data for the MPC8240. Table 5. Preliminary Power Consumption Mode 33/66/166 Typical 2.5 Maximum—FP 2.9 Maximum—INT 2.6 Doze 1.8 Nap 667 Sleep 477 Mode Typical—OV DD Typical—GV DD Notes: 1. The values include V ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core frequency; see Section 1.9, “Ordering Information,” for information on ordering parts. 1.4.2.1 AC Operating Frequency Data Table 6 provides the operating frequency information for the MPC8240. ...
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... Freescale Semiconductor, Inc. Table 7. Clock AC Timing Specifications (continued) At recommended operating conditions (see Table 2) with LV Num Characteristic and Condition 16 DLL lock range with DLL_STANDARD = 0 (default) 17 Frequency of operation (OSC_IN) 18 OSC_IN cycle time 19 OSC_IN rise and fall times 20 OSC_IN duty cycle measured at 1 OSC_IN frequency stability ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics 25 MHz MHz MHz 20 ns 100 MHz loop Figure 7. DLL Locking Range Loop Delay vs. Frequency of Operation 1.4.2.3 Input AC Timing Specifications Table 8 provides the input AC timing specifications. See Figure 8 and Figure 9 for the input-output timing diagrams referenced to SDRAM_SYNC_IN and PCI_SYNC_IN, respectively ...
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... Freescale Semiconductor, Inc. Table 8. Input AC Timing Specifications (continued) At recommended operating conditions (see Table 2) with LV Num Characteristic 11a PCI_SYNC_IN (SDRAM_SYNC_IN) to inputs invalid (input hold) 11b HRST_CPU/HRST_CTRL to mode select inputs invalid (input hold) Notes: 1. All memory and related interface input signal specifications are measured from the TTL level (0 the signal in question to the ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics Figure 10 shows the input timing diagram for mode select signals. HRST_CPU/HRST_CTRL Mode Pins Figure 10. Input Timing Diagram for Mode Select Signals 1.4.2.4 Output AC Timing Specification Table 9 provides the processor bus AC timing specifications for the MPC8240. See Figure 8 and Figure 9 for the input-output timing diagrams referenced to SDRAM_SYNC_IN and PCI_SYNC_IN, respectively ...
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... Freescale Semiconductor, Inc. Table 9. Output AC Timing Specifications (continued) At recommended operating conditions (see Table 2) with LV Num Characteristic 14b SDRAM_SYNC_IN to output high impedance (for all others) Notes: 1. All memory and related interface output signal specifications are specified from the the rising edge of the memory bus clock, SDRAM_SYNC_IN to the TTL level (0 ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics Table 10 describes the bit values for the PCI_HOLD_DEL values in PMCR2. Table 10. Power Management Configuration Register 2 at 0x72 Reset Bit Name Value 6–4 PCI_HOLD_DEL xx0 PCI output hold delay values relative to PCI_SYNC_IN. The initial values of bits 6 and 5 are determined by the reset configuration pins MCP and CKE, respectively ...
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... Freescale Semiconductor, Inc. Figure 12 shows the PCI_HOLD_DEL effect on output valid and hold time. PCI_SYNC_IN 12a for 33 MHz PCI PCI_HOLD_DEL = 110 PCI Inputs/Outputs 33 MHz PCI 12a for 66 MHz PCI PCI_HOLD_DEL = 100 PCI Inputs/Outputs 66 MHz PCI PCI Inputs and Outputs Note: Diagram not to scale. ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics Table 11 recommended operating conditions (see Table 2) with LV Num Characteristic 4 Data hold time 5 SCL/SDA fall time (from 2 Clock high period (time needed to either receive a data bit or generate a START or STOP) ...
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... Freescale Semiconductor, Inc. Table 12. MPC8240 Maximum I 2 FDR Hex Divider 14, 15 9216, 10240 16, 17, 3A, 3B, 3C, 3D 12288, 14336, 15360, 16384, 20480, 24576 18, 19 18432, 20480 1A, 1B, 3E, 3F 24576, 28672, 30720, 32768 1C, 1D 36864, 40960 1E, 1F 49152, 61440 Notes: 1. Values are in KHz, unless otherwise specified. ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics 2 Table 13 Output AC Timing Specifications (continued) At recommended operating conditions (see Table 2) with LV Num Characteristic 9 Stop condition setup time Notes: 1. Units for these specifications are in SDRAM_CLK units. 2. The actual values depend on the setting of the digital filter frequency sampling rate (DFFSR) bits in the frequency divider register I2CFDR ...
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... Freescale Semiconductor, Inc. 1 DFFSR FILTER CLK SDA Note: 1. DFFSR filter clock is the SDRAM_CLK clock times DFFSR value. SCL/SDA VM realtime Delay SCL/SDA VM qualified Note: 1. The delay is the local memory clock times DFFSR times 2 plus 1 local memory clock. Figure 16. I 1.4.2.6 PIC Serial Interrupt Mode AC Timing Specifications Table 14 provides the PIC serial interrupt mode AC timing specifications for the MPC8240 ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics Table 14. PIC Serial Interrupt Mode AC Timing Specifications (continued) At recommended operating conditions (see Table 2) with LV Num Characteristic 7 S_INT inputs invalid (hold time) to S_CLK Notes: 1. See the MPC8240 Integrated Processor User’s Manual for a description of the PIC interrupt control register (ICR) describing S_CLK frequency programming ...
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... Freescale Semiconductor, Inc. 1.4.2.7 IEEE 1149.1 (JTAG) AC Timing Specifications Table 15 provides the JTAG AC timing specifications for the MPC8240 while in the JTAG operating mode. Table 15. JTAG AC Timing Specification (Independent of PCI_SYNC_IN) At recommended operating conditions (see Table 2) with LV Num Characteristic TCK frequency of operation 1 TCK cycle time 2 TCK clock pulse width measured at 1 ...
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... Freescale Semiconductor, Inc. Electrical and Thermal Characteristics Electrical and Thermal Characteristics Figure 20 shows the JTAG TRST timing diagram. TCK TRST Figure 20. JTAG TRST Timing Diagram Figure 21 shows the JTAG boundary scan timing diagram. TCK Data Inputs Data Outputs Data Outputs Figure 21. JTAG Boundary Scan Timing Diagram Figure 22 shows the test access port timing diagram ...
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... Freescale Semiconductor, Inc. 1.4.3 Thermal Characteristics Table 16 provides the package thermal characteristics for the MPC8240. Table 16. Package Thermal Characteristics Characteristic Die junction-to-case thermal resistance Die junction-to-board thermal resistance Note: 1. Refer to Section 1.7, “System Design Information,” for details about thermal management 1 ...
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... Freescale Semiconductor, Inc. Package Description Package Description 1.5.2 Mechanical Dimensions Figure 23 provides the mechanical dimensions, top surface, side profile, and pinout for the MPC8240, 352 TBGA package. – F – CORNER Bottom View 352X ∅ D Notes: 1. Drawing not to scale. 2. All measurements are in millimeters (mm). ...
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... Freescale Semiconductor, Inc. 1.5.3 Pinout Listings Table 17 provides the pinout listing for the MPC8240, 352 TBGA package. Table 17. MPC8240 Pinout Listing Name Pin Number C/BE[3:0] P25 K23 F23 A25 DEVSEL H26 FRAME J24 IRDY K25 LOCK J26 AD[31:0] V25 U25 U26 U24 U23 T25 T26 ...
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... Freescale Semiconductor, Inc. Package Description Package Description Table 17. MPC8240 Pinout Listing (continued) Name Pin Number CAS/DQM[0:7] AB1 AB2 K3 K2 AC1 AC2 K1 J1 RAS/CS[0:7] Y4 AA3 AA4 AC4 FOE H1 RCS0 N4 RCS1 N2 SDMA[11: SDMA12/SDBA1 P1 SDBA0 P2 PAR[0:7] AF3 AE3 G4 E2 AE4 AF4 D2 C2 SDRAS AD1 ...
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... Freescale Semiconductor, Inc. Table 17. MPC8240 Pinout Listing (continued) Name Pin Number SCL AF21 PCI_CLK [0:3] AC25 AB25 AE26 AF25 PCI_CLK4/DA3 AF26 PCI_SYNC_OUT AD25 PCI_SYNC_IN AB23 SDRAM_CLK [0: SDRAM_SYNC_OUT C1 SDRAM_SYNC_IN H3 CKO/DA1 B15 OSC_IN AD21 HRST_CTRL A20 HRST_CPU A19 MCP A17 NMI D16 SMI ...
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... Freescale Semiconductor, Inc. Package Description Package Description Table 17. MPC8240 Pinout Listing (continued) Name Pin Number PLL_CFG[0:4]/ A22 B19 A21 B18 B17 DA[10:6] TEST0 AD22 TEST1 B20 TEST2 Y2 TCK AF22 TDI AF23 TDO AC21 TMS AE22 TRST AE23 GND AA2 AA23 AC12 AC15 AC24 ...
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... Freescale Semiconductor, Inc. Table 17. MPC8240 Pinout Listing (continued) Name Pin Number AV 2 AF24 DD DA2 C25 DA[11:13] AD26 AF17 AF19 DA[14:15 Notes: 1. Place pull-up resistors of 120 Ω or less on the TEST0 pin. 2. Treat these pins as no connects unless using debug address functionality. 3. This pin has an internal pull-up resistor that is enabled only when the MPC8240 is in the reset state. The value of the internal pull-up resistor is not guaranteed but is sufficient to ensure that read into configuration bits during reset ...
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... Freescale Semiconductor, Inc. PLL Configurations PLL Configurations 1.6 PLL Configurations The MPC8240 internal PLLs are configured by the PLL_CFG[0:4] signals. For a given PCI_SYNC_IN (PCI bus) frequency, the PLL configuration signals set both the peripheral logic/memory bus PLL (VCO) frequency of operation for the PCI-to-memory frequency multiplying and the MPC603e CPU PLL (VCO) frequency of operation for memory-to-CPU frequency multiplying ...
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... Freescale Semiconductor, Inc. Table 18. MPC8240 Microprocessor PLL Configurations (continued) 1 Ref. PLL_CFG CPU HID1 PCI Clock Input 2 No. [0:4] [0:4] (PCI_SYNC_IN) Range (MHz) 1E 11110 01111 1F 11111 11111 Notes: 1. The processor HID1 values only represent the multiplier of the processor’s PLL (memory-to-processor multiplier); ...
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... Freescale Semiconductor, Inc. System Design Information System Design Information 10 Ω Figure 24. PLL Power Supply Filter Circuit 1.7.2 Power Supply Sizing The power consumption numbers provided in Table 5 do not reflect power from the OV supplies that are non-negligible for the MPC8240. In typical application measurements, the OV ...
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... Freescale Semiconductor, Inc. The SDRAM_SYNC_OUT signal is intended to be routed halfway out to the SDRAM devices and then returned to the SDRAM_SYNC_IN input of the MPC8240. The trace length may be used to skew or adjust the timing window as needed. See the Motorola application note AN1794, “Backside L2 Timing Analysis for PCB Design Engineers,” ...
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... Freescale Semiconductor, Inc. System Design Information System Design Information interface connects primarily through the JTAG port of the processor, with some additional status monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order to fully control the processor. If the target system has independent reset sources, such as voltage monitors, watchdog timers, power supply failures, or push-button switches, the COP reset signals must be merged into these signals with logic ...
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... Freescale Semiconductor, Inc. From Target SRESET Board Sources (if any) HRESET Key KEY 13 No pin 15 16 COP Connector Physical Pin Out Notes: 1. QACK is an output on the MPC8240 and is not required at the COP header for emulation. 2. RUN/STOP normally found on pin 5 of the COP header is not implemented on the MPC8240. ...
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... Freescale Semiconductor, Inc. System Design Information System Design Information voltage, the MPC8240 always performs 3.3-V signaling as described in the PCI Local Bus Specification, (Rev 2.1). The MPC8240 only tolerates 5-V signals when interfaced into a 5-V PCI bus system. 1.7.8 Thermal Management Information This section provides thermal management information for the tape ball grid array (TBGA) package for air-cooled applications ...
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... Freescale Semiconductor, Inc 0.5 Figure 27. Die Junction-to-Ambient Resistance The board designer can choose between several types of heat sinks to place on the MPC8240. Several commercially-available heat sinks for the MPC8240 are provided by the following vendors: Aavid Thermalloy 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 473 Sapena Ct ...
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... Freescale Semiconductor, Inc. System Design Information System Design Information Tyco Electronics Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com Wakefield Engineering 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost ...
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... Freescale Semiconductor, Inc. graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal interface materials improves with increased contact pressure. The use of thermal grease significantly reduces the interface thermal resistance, that is, the bare joint results in a thermal resistance approximately seven times greater than that of the thermal grease joint ...
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... Freescale Semiconductor, Inc. System Design Information System Design Information Shin-Etsu MicroSi, Inc. 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com Thermagon Inc. 4707 Detroit Ave. Cleveland, OH 44102 Internet: www.thermagon.com The following section provides a heat sink selection example using one of the commercially-available heat sinks. ...
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... Freescale Semiconductor, Inc. and conduction) may vary widely. For these reasons recommended that conjugate heat-transfer models for the board, as well as system-level designs, be used. 1.8 Document Revision History Table 19 provides a revision history for this hardware specification. Table 19. Document Revision History Revision Number 0 Preliminary release with some TBDs in the spec tables ...
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... Freescale Semiconductor, Inc. Document Revision History Document Revision History Table 19. Document Revision History (continued) Revision Number 0.3 Removed “PowerPC Platform compliant” from first sentence on cover sheet. Changed PCI 2.1—’compatible’ to ‘compliant’ in Section 1.2. Updated Table 5 and its notes with preliminary power-consumption information. ...
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... Freescale Semiconductor, Inc. Table 19. Document Revision History (continued) Revision Number 0.5 Removed references to GV been completed. Corrected Figure 2 power supply ramp-up time to be before the 100 ms PLL relock time. Table 3: • Deleted input leakage specification @ LV • Changed minimum ‘Input High Voltage for PCI only’ from 0.5*OVDodaoD to 0.65*OVDD and added Note 6. • ...
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... Freescale Semiconductor, Inc. Document Revision History Document Revision History Table 19. Document Revision History (continued) Revision Number 0.6 Updated Technology in Section 1.3 from 0.32 to 0.29 µm. Updated Notes in Table 2. Changed line 2 to reflect supply voltage wording of the other lines. Changed notes 2 and 3 to include all LVDD input tolerant signals. ...
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... Freescale Semiconductor, Inc. Table 19. Document Revision History (continued) Revision Number 3 Throughout this document, the acronym EPIC was changed to PIC. Throughout this document, the register name EICR was changed to ICR Figure 2—The note numbers in the figure were renumbered to reflect the notes. Table 7—Num 15 and 16 were updated, and Note 7 was corrected. ...
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... Freescale Semiconductor, Inc. Ordering Information Ordering Information Table 21. Part Numbers Addressed by XPC8240RXX250x Part Number Specification XPC nnnn Product Code Part Identifier XPC 8240 R = 2.625 V ± 125 mV, Note: For other differences, see applicable specifications. 1.9.3 Part Marking Parts are marked as the example shown in Figure 30. ...
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... Freescale Semiconductor, Inc. THIS PAGE INTENTIONALLY LEFT BLANK MPC8240 Integrated Processor Hardware Specifications For More Information On This Product, Go to: www.freescale.com Ordering Information 51 ...
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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...