XPC8240LZU200E Freescale Semiconductor, XPC8240LZU200E Datasheet - Page 49

• Manufacturer Part Number: XPC8240LZU200E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240LZU200E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 200MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

1.9
Ordering information for the parts fully covered by this specification document is provided in Section 1.9.1,
“Part Numbers Fully Addressed by This Document.” Section 1.9.2, “Part Numbers Not Fully Addressed by
This Document,” lists the part numbers that do not fully conform to the specifications of this document.
These special part numbers require an additional document called a part number specification.
1.9.1
Table 20 provides the Motorola part numbering nomenclature for the MPC8240. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact a local
Motorola sales office. Each part number also contains a revision code that refers to the die mask revision
number. The revision level can be determined by reading the Revision ID register at address offset 0x08.
1.9.2
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications that supplement and supersede this document. Table 21
shows the part numbers addressed by the XPC8240RXX250x part number specifications.
MPC8240 Integrated Processor Hardware Specifications
Notes:
1. See Section 1.5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in
Revision
Number
Product Code
this specification support all core frequencies. Additionally, parts addressed by part number specifications may
support other maximum core frequencies.
3
4
XPC
XPC
Ordering Information
Throughout this document, the acronym EPIC was changed to PIC.
Throughout this document, the register name EICR was changed to ICR
Figure 2—The note numbers in the figure were renumbered to reflect the notes.
Table 7—Num 15 and 16 were updated, and Note 7 was corrected.
Figure 5 was updated to reflect the changes made in Table 7.
Section 1.7.6—Updated this section and Figure 23.
Section 1.9.1—Updated Table 20.
Section 1.9.2—Updated Table 21.
Section 1.4.1.2—Added Figure 4 and 5, Overshoot and Undershoot Voltage of PCI Interface
Section 1.5.1—Added solder ball package information for Lead free TBGA offering
Section 1.9—Added information regarding Lead free TBGA offering.
Part Numbers Fully Addressed by This Document
Part Numbers Not Fully Addressed by This Document
Part Identifier
nnnn
8240
Table 19. Document Revision History (continued)
Freescale Semiconductor, Inc.
For More Information On This Product,
Table 20. Part Numbering Nomenclature
L = 2.5 V ± 125 mV
0 to 105°C
Descriptor
Go to: www.freescale.com
Process
x
Substantive Change(s)
ZU = TBGA
V V = Lead free
TBGA
Package
xx
1
Frequency
Processor
nnn
200
2
Ordering Information
E: 1.3, Revision ID 0x13
Revision Level
x
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