XPC8240LZU200E Freescale Semiconductor, XPC8240LZU200E Datasheet - Page 44

• Manufacturer Part Number: XPC8240LZU200E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240LZU200E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 200MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

System Design Information
System Design Information
The following section provides a heat sink selection example using one of the commercially-available heat
sinks.
1.7.8.3
For preliminary heat sink sizing, the die-junction temperature, T
where
During operation, the die-junction temperatures (T
in Table 2. The temperature of the air cooling the component greatly depends on the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (T
range of 5° to 10°C. The thermal resistance of the thermal interface material (R
1°C/W. Assuming a T
of 5.0 watts, the following expression for T
For preliminary heat sink sizing, the heat sink base-to-ambient thermal resistance is needed from the heat
sink manufacturer.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure
of merit used for comparing the thermal performance of various microelectronic packaging technologies,
one should exercise caution when using only this metric in determining thermal management because no
single parameter can adequately describe three-dimensional heat flow. The final die-junction operating
temperature is not only a function of the component-level thermal resistance, but the system-level design
and its operating conditions. In addition to the component's power consumption, a number of factors affect
the final operating die-junction temperature: airflow, board population (local heat flux of adjacent
components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, and so on.
Due to the complexity and the many variations of system-level boundary conditions for today’s
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
44
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4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
T
R
R
R
P
T
A
D
J
J
R
J
θ
θ
θ
JC
INT
SA
is the die-junction temperature
= T
= 30°C + 5°C + (1.8°C/W + 1.0°C/W + R
is the power dissipated by the device
is the inlet cabinet ambient temperature
is the air temperature rise within the computer cabinet
is the junction-to-case thermal resistance
Heat Sink Selection Example
is the heat sink base-to-ambient thermal resistance
is the adhesive or interface material thermal resistance
A
A
) may range from 30° to 40°C. The air temperature rise within a cabinet (T
+ T
R
+ (R
A
MPC8240 Integrated Processor Hardware Specifications
of 30°C, a T
θ
JC
Freescale Semiconductor, Inc.
+ R
For More Information On This Product,
θ
INT
R
of 5°C, a TBGA package R
+ R
Go to: www.freescale.com
θ
SA
J
is obtained for die-junction temperature:
) × P
D
J
) should be maintained at less than the value specified
θ
SA
) × 5.0 W
J,
888-642-7674
888-246-9050
θ
can be expressed as follows:
JC
= 1.8, and a power consumption (P
θ
INT
) is typically about
R
) may be in the
D
)