MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 2

• Manufacturer Part Number: MPC8544VTALF
• Description: MPU POWERQUICC III 783-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8544VTALF

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 667MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 667 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 1.8 V, 3.3 V
• Interface Type: I2C, HSSI, DUART
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MPC8544E Overview
The e500 defines features that are not implemented on this device. It also generally defines some features
that this device implements more specifically. An understanding of these differences can be critical to
ensure proper operations.
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— Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit)
— 36-bit real addressing
— Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set
— Memory management unit (MMU). Especially designed for embedded applications. Supports
— Enhanced hardware and software debug support
— Performance monitor facility that is similar to, but separate from, the device performance
256-Kbyte L2 cache/SRAM
— Flexible configuration
— Full ECC support on 64-bit boundary in both cache and SRAM modes
— Cache mode supports instruction caching, data caching, or both.
— External masters can force data to be allocated into the cache through programmed memory
— Eight-way set-associative cache organization (32-byte cache lines)
— Supports locking entire cache or selected lines. Individual line locks are set and cleared through
— Global locking and flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be flash cleared separately.
— SRAM features include the following:
Address translation and mapping unit (ATMU)
— Eight local access windows define mapping within local 36-bit address space.
— Inbound and outbound ATMUs map to larger external address spaces.
DDR/DDR2 memory controller
— Programmable timing supporting DDR and DDR2 SDRAM
— 64-bit data interface
floating-point instructions that use the 64-bit GPRs.
for single-precision (32-bit) floating-point instructions.
4-Kbyte–4-Gbyte page sizes.
monitor
ranges or special transaction types (stashing).
– 1, 2, or 4 ways can be configured for stashing only.
Book E instructions or by externally mastered transactions.
– I/O devices access SRAM regions by marking transactions as snoopable (global).
– Regions can reside at any aligned location in the memory map.
– Byte-accessible ECC is protected using read-modify-write transaction accesses for
– Three inbound windows plus a configuration window on PCI and PCI Express
– Four outbound windows plus default translation for PCI and PCI Express
smaller-than-cache-line accesses.
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor