MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 97
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MPC8544VTALF
Manufacturer Part Number
MPC8544VTALF
Description
MPU POWERQUICC III 783-PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
Specifications of MPC8544VTALF
Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
667MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
1.8 V, 3.3 V
Interface Type
I2C, HSSI, DUART
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8544VTALF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8544VTALFA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Table 71
Simulations with heat sinks were done with the package mounted on the 2s2p thermal test board. The
thermal interface material was a typical thermal grease such as Dow Corning 340 or Wakefield 120 grease.
For system thermal modeling, the MPC8544E thermal model without a lid is shown in
substrate is modeled as a block 29 × 29 × 1.18 mm with an in-plane conductivity of 18.0 W/m•K and a
through-plane conductivity of 1.0 W/m•K. The solder balls and air are modeled as a single block
29 × 29 × 0.58 mm with an in-plane conductivity of 0.034 W/m•K and a through plane conductivity of
12.1 W/m•K. The die is modeled as 7.6 × 8.4 mm with a thickness of 0.75 mm. The bump/underfill layer
is modeled as a collapsed thermal resistance between the die and substrate assuming a conductivity of
6.5 W/m•K in the thickness dimension of 0.07 mm. The die is centered on the substrate. The thermal model
uses approximate dimensions to reduce grid. Please refer to
20.2
Table 72
Freescale Semiconductor
Wakefield 53 × 53 × 25 mm pin fin
Wakefield 53 × 53 × 25 mm pin fin
Aavid 35 × 31 × 23 mm pin fin
Aavid 35 × 31 × 23 mm pin fin
Aavid 30 × 30 × 9.4 mm pin fin
Aavid 30 × 30 × 9.4 mm pin fin
Aavid 43 × 41 × 16.5 mm pin fin
Aavid 43 × 41 × 16.5 mm pin fin
Conductivity
provides the thermal resistance with heat sink in open flow.
shows the MPC8544E thermal model.
Recommended Thermal Model
Heat Sink with Thermal Grease
Silicon
Kz
Kx
Ky
Kz
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Bump/Underfill (7.6 × 8.4 × 0.070 mm) Collapsed Thermal Resistance
Table 71. Thermal Resistance with Heat Sink in Open Flow
Table 72. MPC8544EThermal Model
Substrate (29 × 29 × 1.18 mm)
Temperature dependent
Die (7.6 × 8.4 × 0.75mm)
Value
6.5
1.0
18
18
Natural convection
Natural convection
Natural convection
Natural convection
Air Flow
1 m/s
1 m/s
1 m/s
1 m/s
Figure 59
for actual dimensions.
Thermal Resistance (°C/W)
W/m•K
W/m•K
Units
Figure
—
11.6
6.1
3.0
8.1
4.3
6.7
8.3
4.3
60. The
Thermal
97