MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 99
![MPU POWERQUICC III 783-PBGA](/photos/37/62/376266/mpc8544e_image_sml.jpg)
MPC8544VTALF
Manufacturer Part Number
MPC8544VTALF
Description
MPU POWERQUICC III 783-PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
Specifications of MPC8544VTALF
Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
667MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
1.8 V, 3.3 V
Interface Type
I2C, HSSI, DUART
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8544VTALF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8544VTALFA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
20.3
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC8544E implements
several features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see
information.
The recommended attachment method to the heat sink is illustrated in
attached to the printed-circuit board with the spring force centered over the die. This spring force should
not exceed 10 pounds force (45 Newton).
The system board designer can choose between several types of heat sinks to place on the device. There
are several commercially-available heat sinks from the following vendors:
Freescale Semiconductor
Aavid Thermalloy603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Thermal Management Information
Figure 61. Package Exploded Cross-Sectional View with Several Heat Sink Options
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Thermal Interface Material
Printed-Circuit Board
Adhesive or
Heat Sink
Heat Sink
Clip
Die
Section 20.3.4, “Temperature Diode,”
FC-PBGA Package
Figure
61. The heat sink should be
for more
Thermal
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