MC68EC040FE25A Freescale Semiconductor, MC68EC040FE25A Datasheet - Page 341

• Manufacturer Part Number: MC68EC040FE25A
• Description: IC MPU 32BIT 25MHZ 184-CQFP
• Manufacturer: Freescale Semiconductor
• Series: M68000r

Specifications of MC68EC040FE25A

• Processor Type: M680x0 32-Bit
• Speed: 25MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 184-CQFP
• Core Size: 32bit
• Program Memory Size: 8KB
• Cpu Speed: 25MHz
• Digital Ic Case Style: CQFP
• No. Of Pins: 184
• Supply Voltage Range: 4.75V To 5.25V
• Operating Temperature Range: 0°C To
• Rohs Compliant: Yes
• Family Name: M68000
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 25MHz
• Instruction Set Architecture: RISC
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 184
• Package Type: CQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

rated at a particular maximum operating frequency is dependent upon the power-up
mode. Therefore, the MC68040 is rated at a maximum power dissipation for either the
large or small buffers at a particular frequency. This allows for control of some of the
thermal management upon reset. The following equation provides a rough method to
calculate the maximum power consumption for a chosen output buffer mode:
Table 11-1 lists the simplified relationship on the maximum power dissipation for eight
possible configurations of output buffer modes.
To calculate the specific power dissipation of a design, the termination method of each
signal must be considered. For example, a signal output that is not connected would not
dissipate any additional power if it were configured in the large rather than the small buffer
mode. Since the maximum operating junction temperature is specified as 110 C, the
maximum case temperature (T
where:
MOTOROLA
where:
PINS
PINS
P
*The MC68LC040 and MC68EC040 only utilize this row of information.
T
T
JC
C
D
J
P
P
DSB
CLB
DLB
= Maximum Case Temperature
= Maximum Junction Temperature
= Maximum Power Dissipation of the Device
= Thermal Resistance between the Junction of the Die and the Case
P
Data Bus
LB
Small*
D
Small
Small
Small
Large
Large
Large
Large
= Maximum Power Dissipation for Output Buffer Mode Selected
= Maximum Power Dissipation for Small Buffer Mode (All Outputs)
= Maximum Power Dissipation for Large Buffer Mode (All Outputs)
= Number of Pins Large Buffer Mode
= Number of Pins Capable of the Large Buffer Mode
P
D
Table 11-1. Maximum Power Dissipation for
Transfer Attributes
Output Configuration
Address Bus and
= P
Freescale Semiconductor, Inc.
For More Information On This Product,
Output Buffer Mode Configurations
DSB
Small
Large
Large
Small
Small
Large
Large
Small
C
+ (P
) in C can be obtained from the following equation:
Go to: www.freescale.com
M68040 USER’S MANUAL
DLB
T
C
= T
– P
DSB
J
Control Signals
– P
)
Small
Large
Small
Large
Small
Large
Small
Large
D
( PINS
JC
LB
P
P
P
P
P
P
P
P
DSB
DSB
DSB
DSB
DSB
DSB
DSB
DSB
PINS
Maximum Power Dissipation
+ (P
+ (P
+ (P
+ (P
+ (P
+ (P
+ (P
CLB
DLB
DLB
DLB
DLB
DLB
DLB
DLB
)
– P
– P
– P
– P
– P
– P
– P
DSB
DSB
DSB
DSB
DSB
DSB
DSB
)
)
)
)
)
)
)
13%
52%
65%
35%
87%
48%
100%
11-13