VSC8601XKN Vitesse Semiconductor Corp, VSC8601XKN Datasheet - Page 95

IC PHY 10/100/1000 64-EP-LQFP

VSC8601XKN

Manufacturer Part Number
VSC8601XKN
Description
IC PHY 10/100/1000 64-EP-LQFP
Manufacturer
Vitesse Semiconductor Corp
Type
PHY Transceiverr
Datasheets

Specifications of VSC8601XKN

Number Of Drivers/receivers
1/1
Protocol
Gigabit Ethernet
Voltage - Supply
2.5V, 3.3V
Mounting Type
Surface Mount
Package / Case
64-LQFP Exposed Pad, 64-eLQFP, 64-HLQFP
Case
TQFP
Dc
06+
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
907-1028

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VSC8601XKN
Manufacturer:
KYOCERA/AVX
Quantity:
20 000
Part Number:
VSC8601XKN
Manufacturer:
VITESSE
Quantity:
1 235
Part Number:
VSC8601XKN
Manufacturer:
Vitesse Semiconductor Corporation
Quantity:
10 000
Part Number:
VSC8601XKN
Manufacturer:
VITESSE
Quantity:
20 000
Company:
Part Number:
VSC8601XKN
Quantity:
28 588
7.2
Table 86.
7.3
Revision 4.1
September 2009
Thermal Specifications
Thermal specifications for this device are based on the JEDEC standard EIA/JESD51-2
and have been modeled using a four-layer test board with two signal layers, a power
plane, and a ground plane (2s2p PCB). For more information, see the JEDEC standard.
Thermal Resistances
1. Simulated on the top of the mold compound with the exposed pad soldered to a ground pad on
2. Calculated on the exposed pad soldered to a ground pad on the PCB.
To achieve results similar to the modeled thermal resistance measurements, the
guidelines for board design described in the JEDEC standard EIA/JESD51 series must be
applied. For information about specific applications, see the following:
EIA/JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct
Thermal Attachment Mechanisms
EIA/JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface
Mount Packages
EIA/JESD51-9, Test Boards for Area Array Surface Mount Package Thermal
Measurements
EIA/JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal
Measurements
EIA/JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal
Measurements
Moisture Sensitivity
This device is rated moisture sensitivity level 3 or better as specified in the joint IPC
and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and
JEDEC standard.
Part Order Number
VSC8601XKN
the PCB.
18.5
6.4
θ
JC
(2)
(1)
θ
22
JB
θ
JA
33
0
(°C/W) vs. Airflow (ft/min)
100
Package Information
30
VSC8601 Datasheet
200
Page 95
28

Related parts for VSC8601XKN