ADF7023-JBCPZ Analog Devices Inc, ADF7023-JBCPZ Datasheet - Page 98
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ADF7023-JBCPZ
Manufacturer Part Number
ADF7023-JBCPZ
Description
TXRX FSK/GFSK/MSK/GMSK 32LFCSP
Manufacturer
Analog Devices Inc
Series
-r
Datasheet
1.EVAL-ADF7023-JDB1Z.pdf
(100 pages)
Specifications of ADF7023-JBCPZ
Frequency
902MHz ~ 958MHz
Data Rate - Maximum
300kbps
Modulation Or Protocol
FSK, GFSK, GMSK, MSK
Applications
ISM
Power - Output
13.5dBm
Sensitivity
-116dBm
Voltage - Supply
2.2 V ~ 3.6 V
Current - Receiving
12.8mA
Current - Transmitting
32.1mA
Data Interface
PCB, Surface Mount
Memory Size
-
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
32-WFQFN Exposed Pad, CSP
Rf Ic Case Style
LFCSP
No. Of Pins
32
Supply Voltage Range
2.2V To 3.6V
Operating Temperature Range
-40°C To +85°C
Transmitting Current
32.1mA
Data Rate
300Kbps
Modulation Type
2FSK, GFSK, MSK
Rohs Compliant
Yes
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
ADF7023-J
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADF7023-JBCPZ
ADF7023-JBCPZ-RL
EVAL-ADF7XXXMB3Z
EVAL-ADF7023-JDB1Z
EVAL-ADF7023-JDB2Z
1
Z = RoHS Compliant Part.
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
INDICATOR
SEATING
PLANE
0.80
0.75
0.70
PIN 1
Figure 88. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
TOP VIEW
5.10
5.00 SQ
4.90
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
Package Description
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board (USB Motherboard)
Evaluation Board (RF Daughterboard, 950 MHz, Separate Match)
Evaluation Board (RF Daughterboard, 950 MHz, Combined Match)
5 mm × 5 mm Body, Very Very Thin Quad
Dimensions shown in millimeters
Rev. 0 | Page 98 of 100
0.20 REF
(CP-32-13)
0.05 MAX
0.02 NOM
0.50
0.40
0.30
COPLANARITY
BSC
0.50
0.08
24
17
0.30
0.25
0.18
25
16
BOTTOM VIEW
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
32
9
8
1
3.45
3.30 SQ
3.15
0.25 MIN
Package Option
CP-32-13
CP-32-13